MC9S08AW16MPUE vs S9S08AW16AE0CLDR Comparación
Comparación detallada lado a lado de MC9S08AW16MPUE por NXP Semiconductors y S9S08AW16AE0CLDR por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MC9S08AW16MPUE - 8-bit HCS08 MCU, 16KB Flash, 64-LQFP | NXP
MC9S08AW16MPUE ✓ ActivoNXP Semiconductors
S9S08AW16AE0CLDR - 8-bit S08 MCU 16KB Flash LQFP-44 | NXP
S9S08AW16AE0CLDR ✓ ActivoComparación de especificaciones
| Parámetro | MC9S08AW16MPUE | S9S08AW16AE0CLDR |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $4,35 | $2,60 |
| Core | HCS08 (enhanced S08) | — |
| Ancho del bus de datos | 8 bit | — |
| Program Memory Size | 16 KB Flash | 16 KB (16K x 8) |
| RAM Size | 1 KB | 1 KB (1K x 8) |
| Frecuencia de reloj máxima | 40 MHz | — |
| ADC Resolution | 10 bit | — |
| Number of I/Os | 54 I/O | — |
| Tensión de alimentación de funcionamiento | 2.7 V to 5.5 V | — |
| Minimum Operating Temperature | -40 C | — |
| Maximum Operating Temperature | +125 C (Automotive Grade 1) | — |
| Estilo de montaje | SMD/SMT | — |
| Encapsulado / Carcasa | 64-LQFP (10x10 mm, gull-wing) | — |
| Package Code (per JEDEC) | LFQFP | — |
| Series | MC9S08AW16 (S08AW family) | — |
| Communication Interfaces | SCI, SPI, I2C | — |
| Timers | TPM, MTIM, RTI | — |
| Watchdog | Yes (COP) | — |
| Low Voltage Detect (LVD) | Yes | — |
| Estado RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Core Processor | — | S08 |
| Core Size | — | 8-Bit |
| Core Architecture | — | HCS08 |
| CPU Speed | — | 40 MHz |
| Internal Bus Frequency | — | 20 MHz |
| Program Memory Type | — | FLASH |
| EEPROM Size | — | [DATA_NEEDED: EEPROM size] |
| Number of I/O | — | 34 |
| Connectivity | — | I2C, SCI (UART), SPI |
| Peripherals | — | LVD, POR, PWM, WDT |
| Encapsulado | — | 44-LQFP (10x10 mm) |
| Temperatura de funcionamiento | — | -40C to +85C |
| Tensión de alimentación | — | 3 V (typical) |
| Tipo de montaje | — | Surface Mount |
| Nivel MSL | — | [DATA_NEEDED: MSL level] |
| Debug Interface | — | Single-wire BDM (Background Debug Mode) |
| AEC-Q100 Qualified | — | Yes (Automotive) |