MC9S08AW32CFUE vs MC9S08AW50CFUE Comparación
Comparación detallada lado a lado de MC9S08AW32CFUE por NXP Semiconductors y MC9S08AW50CFUE por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | MC9S08AW32CFUE | MC9S08AW50CFUE |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | NRND | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $7,18 | $0,00 |
| Core | S08 (HCS08 enhanced 8-bit) | — |
| Program Memory | 32 KB Flash | — |
| RAM | 2 KB | [DATA_NEEDED: SRAM size] |
| Maximum CPU Frequency | 40 MHz | — |
| Operating Voltage | 2.7 V to 5.5 V | — |
| ADC | 10-bit, 8-channel | — |
| Communication Interfaces | 2x SCI (UART), 1x SPI, 1x IIC | — |
| Timers | Multiple TPM/MTIM (see datasheet) | — |
| GPIO | Up to 54 | — |
| Encapsulado | 64-QFP (14x14 mm) | 64-QFP (14x14 mm) |
| Tipo de montaje | Surface Mount | Surface Mount |
| Temperatura de funcionamiento | -40C to +85C (industrial) | [DATA_NEEDED: operating temperature range] |
| Nivel MSL | 3 | — |
| Estado RoHS | Compliant | [DATA_NEEDED: RoHS compliance] |
| Debug Interface | BDM (Background Debug Mode) | — |
| Lead-Free | Yes | — |
| Core Processor | — | HCS08 (S08) |
| Core Size | — | 8-Bit |
| Maximum Clock Speed | — | 40 MHz |
| Flash Memory | — | 50 KB (50K x 8) |
| Connectivity | — | I2C, SCI, SPI, UART/USART |
| Peripherals | — | LVD, POR |
| Product Family | — | S08AW (AW60/48/32/16 general-purpose family) |
| Applications | — | Industrial and Automotive |
| Supply Voltage Range | — | [DATA_NEEDED: supply voltage range] |
| EEPROM | — | [DATA_NEEDED: EEPROM size] |
| Number of I/O | — | [DATA_NEEDED: GPIO count] |
| ADC Resolution | — | [DATA_NEEDED: ADC resolution and channels] |