MC9S08AW32CPUE vs MC9S08AC32MPUE Comparación
Comparación detallada lado a lado de MC9S08AW32CPUE por NXP Semiconductors y MC9S08AC32MPUE por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MC9S08AC32MPUE - 32KB Flash 8-bit MCU 40MHz LQFP-64 | NXP
MC9S08AC32MPUE ✓ ActivoComparación de especificaciones
| Parámetro | MC9S08AW32CPUE | MC9S08AC32MPUE |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | NRND | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $6,10 | $5,42 |
| Core Processor | S08 | — |
| Core Size | 8-Bit | — |
| Max Clock Speed | 40 MHz | — |
| Internal Bus Frequency | 20 MHz | — |
| Flash Memory | 32KB (32K x 8) | — |
| RAM | 2KB | 2 KB |
| Supply Voltage Range | 2.7 V to 5.5 V | 2.7 V to 5.5 V |
| I/O Count | 38 | — |
| ADC Resolution | 10-bit | — |
| Instruction Set | HC08 with added BGND instruction | — |
| Debug Interface | Single-wire background debug mode (BDM) | Background Debug Mode (BDM) |
| Encapsulado | 64-LQFP (10x10 mm, 0.5 mm pitch, MO-220) | 64-LQFP (10x10 mm) |
| Tipo de montaje | Surface Mount | Surface Mount (LQFP) |
| Temperatura de funcionamiento | -40C to +85C | — |
| Packaging | Tray | — |
| Estado del ciclo de vida | NRND (Not Recommended for New Designs) | — |
| Family | S08AW (AW60/48/32/16) | — |
| Core Architecture | — | HCS08 (S08 core, 8-bit CISC) |
| CPU Clock Speed | — | 40 MHz (up to 40 MIPS) |
| Program Memory (Flash) | — | 32 KB |
| I/O Pins | — | 38 |
| Rango de temperatura de funcionamiento | — | -40C to +85C (industrial) |
| ADC | — | 10-bit, multi-channel |
| Communication Interfaces | — | I2C, SCI (UART), SPI |
| Timers/PWM | — | TPM modules with PWM |
| Internal Oscillator | — | Yes |
| RoHS Compliance | — | RoHS Compliant |