MC9S08AW32CPUE vs MC9S08DZ32AMLH Comparación
Comparación detallada lado a lado de MC9S08AW32CPUE por NXP Semiconductors y MC9S08DZ32AMLH por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | MC9S08AW32CPUE | MC9S08DZ32AMLH |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | NRND | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $6,10 | $0,00 |
| Core Processor | S08 | HCS08 (S08 core) |
| Core Size | 8-Bit | 8-Bit |
| Max Clock Speed | 40 MHz | — |
| Internal Bus Frequency | 20 MHz | — |
| Flash Memory | 32KB (32K x 8) | — |
| RAM | 2KB | — |
| Supply Voltage Range | 2.7 V to 5.5 V | — |
| I/O Count | 38 | — |
| ADC Resolution | 10-bit | 12 bit |
| Instruction Set | HC08 with added BGND instruction | HC08 with added BGND instruction (CISC) |
| Debug Interface | Single-wire background debug mode (BDM) | On-chip emulation/debug (background debug, BGND) |
| Encapsulado | 64-LQFP (10x10 mm, 0.5 mm pitch, MO-220) | 64-LQFP (10x10 mm) |
| Tipo de montaje | Surface Mount | Surface Mount |
| Temperatura de funcionamiento | -40C to +85C | — |
| Packaging | Tray | Tray |
| Estado del ciclo de vida | NRND (Not Recommended for New Designs) | NRND (Not Recommended for New Designs) |
| Family | S08AW (AW60/48/32/16) | — |
| Maximum CPU Frequency | — | 40 MHz |
| Bus Frequency | — | 20 MHz |
| Program Memory Size | — | 32KB (32K x 8) FLASH |
| Tensión de alimentación | — | 3.3V / 5V |
| ADC Channels | — | 24-channel |
| ADC Conversion Time | — | 2.5 us |
| CAN Module | — | Yes (embedded CAN, MSCAN) |
| EEPROM | — | Embedded EEPROM |
| Interrupt/Reset Sources | — | Up to 32 |
| Series | — | S08DZ (S08 Family, S08D Series) |
| Product Category | — | Microcontrollers (MCU) |