MC9S08DV48AMLC vs MC9S08DV60AMLC Comparación
Comparación detallada lado a lado de MC9S08DV48AMLC por NXP Semiconductors y MC9S08DV60AMLC por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | MC9S08DV48AMLC | MC9S08DV60AMLC |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Obsolete | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $4,73 | $2,45 |
| Core Processor | S08 (HCS08) | S08 (HCS08) |
| Core Size | 8-Bit | 8-Bit |
| Maximum CPU Speed | 40 MHz (20 MHz bus) | — |
| Program Memory Size | 48KB (48K x 8) | — |
| Program Memory Type | FLASH | — |
| RAM Size | 2K x 8 | 3 KB |
| EEPROM Size | - | — |
| Connectivity | CANbus, I2C, LINbus, SCI, SPI | — |
| Peripherals | LVD, POR, PWM, WDT | — |
| Number of I/O | 25 | [DATA_NEEDED: GPIO count] |
| Interrupt/Reset Sources | Up to 32 | Up to 32 |
| Tensión de alimentación | 3.3 V / 5 V | [DATA_NEEDED: supply voltage range] |
| Temperatura de funcionamiento | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: operating temperature range] |
| Encapsulado | 32-LQFP (7 x 7 mm) | 32-LQFP (7 x 7 mm) |
| Tipo de montaje | Surface Mount | Surface Mount |
| Terminal Form | Gull Wing | — |
| Temperature Grade | Automotive | — |
| Part Status | Obsolete | — |
| Instruction Set | HC08 with added BGND instruction | HC08 with added BGND instruction |
| Maximum CPU Frequency | — | 40 MHz (20 MHz bus) |
| Flash Memory | — | 60 KB (60K x 8) |
| On-Chip Debug | — | Background Debug Mode (BDM) emulation/debug |
| Communication Interface | — | Embedded CAN |
| Target Markets | — | Automotive and industrial |
| Estado RoHS | — | [DATA_NEEDED: RoHS status] |
| Estado del ciclo de vida | — | NRND (Not Recommended for New Designs) |