MC9S08DV60CLF vs MC9S08JM60CLD Comparación

Comparación detallada lado a lado de MC9S08DV60CLF por NXP Semiconductors y MC9S08JM60CLD por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.

NXP Semiconductors
MC9S08DV60CLF MC9S08DV60CLF - 8-Bit 40MHz 60KB MCU | NXP Semiconductors

MC9S08DV60CLF - 8-Bit 40MHz 60KB MCU | NXP Semiconductors

MC9S08DV60CLF Unknown
NXP Semiconductors
MC9S08JM60CLD MC9S08JM60CLD - 8-bit USB MCU, 60KB Flash, 44-LQFP | NXP

MC9S08JM60CLD - 8-bit USB MCU, 60KB Flash, 44-LQFP | NXP

MC9S08JM60CLD Nrnd

Comparación de especificaciones

Parámetro MC9S08DV60CLF MC9S08JM60CLD
Marca NXP Semiconductors NXP Semiconductors
Categoría Microcontrollers Microcontrollers
Estado del ciclo de vida Unknown NRND
Estado del stock In Stock In Stock
Precio unitario (USD) $0,00 $4,40
Product Type 8-bit HCS08 embedded microcontroller —
Program Memory Size 60KB (60K x 8) Flash —
RAM Size 3K x 8 RAM —
CPU Speed 40MHz —
Bus Speed 20MHz —
Instruction Set HC08 instruction set with added BGND instruction —
Number of I/O 39 I/O according to the supplied distributor specification —
General-Purpose I/O 53 pins plus 1 input-only pin in the supplied manufacturer datasheet listing —
ADC Channels 16 channels —
ADC Resolution 12-bit —
ADC Conversion Time 2.5 s as stated in the supplied distributor specification —
Interrupt and Reset Sources Up to 32 interrupt/reset sources —
Oscillator Type External —
Program Memory Type Flash —
Encapsulado 48-LQFP (7x7 mm) 44-LQFP (10x10 mm, 0.8 mm pitch)
Tipo de montaje Surface Mount Surface Mount
Packaging Tray —
Manufacturer NXP Semiconductors —
Core Processor — S08 (HCS08 family)
Core Size — 8-bit
Maximum Clock Speed — 48 MHz (24 MHz internal bus)
Program Memory — 60 KB Flash
RAM — 4 KB
USB Module — USB 2.0 Full-Speed Device Controller with integrated transceiver
ADC — 12-channel, 12-bit SAR
Timers (TPM) — 2 channels (TPM1, TPM2)
Communication Peripherals — 1x SPI, 1x I2C, 2x SCI (LIN-capable)
I/O Count — 33 GPIO
Tensión de alimentación — 2.7 V to 5.5 V
Internal Regulator Output — 3.3 V / 100 mA
Temperatura de funcionamiento — -40C to +85C
Debug Interface — Background Debug Mode (BDM)
Lead Free / RoHS — Yes / Compliant

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