MC9S08GT16CFBE vs S9S08AW16AE0MLC Comparación
Comparación detallada lado a lado de MC9S08GT16CFBE por NXP Semiconductors y S9S08AW16AE0MLC por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
S9S08AW16AE0MLC - 8-bit HCS08 MCU, 16KB Flash, CAN, LQFP-32 | NXP
S9S08AW16AE0MLC ✓ ActivoComparación de especificaciones
| Parámetro | MC9S08GT16CFBE | S9S08AW16AE0MLC |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Obsolete | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $4,65 | $3,29 |
| Core Processor | S08 (HCS08) 8-bit CISC | — |
| Core Size | 8-Bit | — |
| Maximum Bus Frequency | 40 MHz | — |
| Flash Memory | 16 KB (16K x 8) | — |
| RAM | 2 KB | 1 KB |
| EEPROM | None (Flash-based) | — |
| Tensión de alimentación | 2.5 V / 3.3 V | 2.7 V to 5.5 V |
| ADC Resolution | 10-bit (8 channels) | — |
| Communication Interfaces | I2C, SCI, SPI | 2x SCI (UART), 1x SPI, 1x I2C |
| Peripherals | LVD, POR, PWM, WDT | — |
| Number of I/O | 36 | — |
| Encapsulado | 44-QFP (10x10 mm) | 32-pin LQFP, 7 x 7 mm |
| Tipo de montaje | Surface Mount | Surface Mount (gull-wing) |
| Packaging | Tray | — |
| Temperatura de funcionamiento | [DATA_NEEDED: operating temperature range] | -40 C to +125 C (automotive AEC-Q100) |
| Estado RoHS | [DATA_NEEDED: RoHS status] | — |
| Core | — | HCS08 (enhanced HC08) 8-bit |
| CPU Frequency | — | 40 MHz (20 MHz internal bus) |
| Program Flash | — | 16 KB |
| CAN Module | — | MSCAN (CAN 2.0 A/B) |
| ADC | — | 10-bit, 8-channel |
| Timers/PWM | — | 6-channel 16-bit |
| GPIO (max) | — | 27 |
| Debug Interface | — | Single-wire BDM (background debug mode) |
| Instruction Set | — | HC08 with BGND extension |