MC9S08GT60CFD vs MC9S08AW60CFGE Comparación
Comparación detallada lado a lado de MC9S08GT60CFD por NXP Semiconductors y MC9S08AW60CFGE por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MC9S08GT60CFD - 8-bit 40MHz S08 MCU 60KB Flash QFN48 | NXP
MC9S08GT60CFD ✓ Activo
Comparación de especificaciones
| Parámetro | MC9S08GT60CFD | MC9S08AW60CFGE |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Activo | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $5,10 | $0,00 |
| Manufacturer | NXP Semiconductors (formerly Freescale) | — |
| Part Family | HCS08 S08GT Series | — |
| Core Architecture | HCS08 (8-bit CISC) | — |
| Program Memory Size | 60 KB (60K x 8) Flash | — |
| RAM Size | 4 KB (4K x 8) | [DATA_NEEDED: RAM size] (Mouser listing states 4K; FindIC overview states 2K) |
| Maximum CPU Frequency | 40 MHz | 40 MHz |
| Number of I/O Pins | 39 | — |
| Encapsulado / Carcasa | 48-VFQFN Exposed Pad (48-QFN 7x7 mm) | — |
| Tensión de alimentación de funcionamiento | 2.5V / 3.3V | — |
| Number of Interrupts/Reset Sources | Up to 32 | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Tray Packaging | Tray (per FindIC listing) | — |
| Background Debug Mode | Yes (BGND instruction) | — |
| Internal Pullup | Yes (RESET and IRQ pins) | — |
| Estado RoHS | [DATA_NEEDED: RoHS compliance status] | — |
| Core Processor | — | S08 (HCS08) 8-bit CISC |
| Core Size | — | 8-Bit |
| Internal Bus Frequency | — | 20 MHz |
| Flash Memory | — | 60 KB (60K x 8) |
| Supply Voltage Range | — | 2.7 V to 5.5 V |
| I/O Count | — | 38 general-purpose I/O |
| ADC Resolution | — | 10-bit, 8-channel |
| Instruction Set | — | HC08 instruction set with added BGND instruction |
| Debug Interface | — | Single-wire background debug mode (BDM) |
| Encapsulado | — | 44-LQFP (10x10 mm), 0.50 mm pitch, MO-220VKKD-2 |
| Supply Voltage Nominal | — | 3.3 V / 5 V |
| Temperatura de funcionamiento | — | [DATA_NEEDED: operating temperature range] |
| Packaging | — | Tray |
| Estado del ciclo de vida | — | NRND (Not Recommended for New Designs) per NXP |
| Family | — | MC9S08AW (S08AW series) |