MC9S08PA16VTJ vs MC9S08SL16CTJ Comparación

Comparación detallada lado a lado de MC9S08PA16VTJ por NXP Semiconductors y MC9S08SL16CTJ por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.

NXP Semiconductors
MC9S08PA16VTJ MC9S08PA16VTJ - 8-bit S08 MCU 16KB Flash 20-TSSOP | NXP

MC9S08PA16VTJ - 8-bit S08 MCU 16KB Flash 20-TSSOP | NXP

MC9S08PA16VTJ Nrnd
NXP Semiconductors
MC9S08SL16CTJ MC9S08SL16CTJ - 8-bit S08 MCU 16KB Flash 40MHz | NXP

MC9S08SL16CTJ - 8-bit S08 MCU 16KB Flash 40MHz | NXP

MC9S08SL16CTJ Obsolete

Comparación de especificaciones

Parámetro MC9S08PA16VTJ MC9S08SL16CTJ
Marca NXP Semiconductors NXP Semiconductors
Categoría Microcontrollers Microcontrollers
Estado del ciclo de vida NRND Obsolete
Estado del stock In Stock In Stock
Precio unitario (USD) $1,18 $1,83
Core Architecture HCS08L (S08 family) —
Ancho del bus de datos 8 bit —
Program Memory (Flash) 16 KB —
RAM [DATA_NEEDED: RAM size in KB] —
EEPROM (emulated) Yes (in flash, configurable) —
Maximum Bus Frequency 20 MHz —
Supply Voltage (VDD) 2.7 V to 5.5 V —
Temperatura de funcionamiento -40 C to +105 C [DATA_NEEDED: operating temperature range]
Encapsulado 20-pin TSSOP 20-TSSOP
Tipo de montaje Surface Mount (TSSOP) Surface Mount
I/O Pins Up to 18 GPIO —
ADC On-chip SAR ADC (channel count [DATA_NEEDED: ADC channels]) —
Analog Comparator Yes —
Timers FlexTimer (PWM-capable, channel count [DATA_NEEDED: PWM channels]) —
Interrupts Up to 40 sources, 4-level nested —
Low-Power Modes Wait, Stop (low-power) —
Debug Interface BDM (Background Debug Mode) —
Watchdog COP watchdog —
Estado RoHS Compliant —
Lead-Free / MSL Lead-free; MSL [DATA_NEEDED: MSL level] —
Tube Packaging Standard Qty Per tube (qty [DATA_NEEDED: tube qty]) —
Core Processor — S08 (HCS08)
Core Size — 8-Bit
Maximum Clock Speed — 40 MHz
Program Memory Size — 16KB (16K x 8)
Program Memory Type — FLASH
EEPROM Size — 256 x 8
RAM Size — [DATA_NEEDED: RAM size]
Connectivity — I2C, LINbus, SCI, SPI
Peripherals — LVD, POR, PWM, WDT
Number of I/O — 16
Interrupt/Reset Sources — Up to 32
Tensión de alimentación — 3.3 V / 5 V
Packaging — Tube
Special Module — Embedded Slave LIN Interface Controller (SLIC)
Instruction Set — HC08 compatible with added BGND instruction
Part Status — Obsolete

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