MC9S08QD2CSCR vs MC9S08QD4CSC Comparación
Comparación detallada lado a lado de MC9S08QD2CSCR por NXP Semiconductors y MC9S08QD4CSC por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | MC9S08QD2CSCR | MC9S08QD4CSC |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Activo | Fin de vida |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $0,98 | $0,00 |
| Core Processor | S08 | S08 (HCS08), 8-bit CISC |
| Core Size | 8-Bit | 8-bit |
| Instruction Set Architecture | CISC | — |
| Speed (Bus Frequency) | 16 MHz | — |
| Program Memory Type | Flash | — |
| Program Memory Size | 2KB (2K x 8) | — |
| RAM Size | 128 x 8 | — |
| Number of I/O | 4 | — |
| Tensión de alimentación | 3.3 V / 5 V | 3.3 V / 5 V |
| Oscillator Type | Internal | — |
| Encapsulado / Carcasa | 8-SOIC (0.154 in, 3.90 mm Width) | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Packaging | Tape & Reel | Tube |
| Technology | CMOS | — |
| Product Series | S08QD (9S08QD4 SERIES per distributor listing) | — |
| Estado RoHS | [DATA_NEEDED: RoHS status] | — |
| Temperatura de funcionamiento | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: operating temperature range] |
| Frecuencia de reloj máxima | — | 16 MHz |
| Flash Memory | — | 4 KB (4K x 8) |
| RAM | — | 256 B |
| ADC Resolution | — | 10-bit |
| ADC Channels | — | 4 |
| General-Purpose I/O | — | 6 |
| Instruction Set | — | HC08 with added BGND instruction |
| Debug Interface | — | Background debugging system (single-wire BDM) |
| Encapsulado | — | 8-SOIC |
| Life Cycle Stage | — | End of Life (per NXP product page) |