MC9S08QD4CSC vs MC9S08QD2VSC Comparación
Comparación detallada lado a lado de MC9S08QD4CSC por NXP Semiconductors y MC9S08QD2VSC por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MC9S08QD2VSC - 8-bit S08 MCU, 2KB Flash, 16MHz, SOIC-8 | NXP
MC9S08QD2VSC ✓ ActivoComparación de especificaciones
| Parámetro | MC9S08QD4CSC | MC9S08QD2VSC |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Fin de vida | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $0,00 | $0,81 |
| Core Processor | S08 (HCS08), 8-bit CISC | — |
| Core Size | 8-bit | — |
| Frecuencia de reloj máxima | 16 MHz | — |
| Flash Memory | 4 KB (4K x 8) | — |
| RAM | 256 B | 256 bytes |
| Tensión de alimentación | 3.3 V / 5 V | — |
| ADC Resolution | 10-bit | — |
| ADC Channels | 4 | — |
| General-Purpose I/O | 6 | — |
| Instruction Set | HC08 with added BGND instruction | — |
| Debug Interface | Background debugging system (single-wire BDM) | Background Debug Mode (BDM) |
| Encapsulado | 8-SOIC | 8-SOIC (SO-8) |
| Tipo de montaje | Surface Mount | Surface Mount |
| Packaging | Tube | — |
| Temperatura de funcionamiento | [DATA_NEEDED: operating temperature range] | -40 C to +85 C (V suffix = industrial) |
| Life Cycle Stage | End of Life (per NXP product page) | — |
| Core Architecture | — | HCS08 (enhanced HC08) |
| Program Memory (Flash) | — | 2 KB (2K x 8) |
| CPU Clock (max) | — | 16 MHz |
| Operating Voltage | — | 2.7 V to 5.5 V |
| ADC | — | 4-channel, 10-bit |
| GPIO Pins | — | 6 |
| Timers | — | [DATA_NEEDED: timer module count] |
| Communication Peripherals | — | [DATA_NEEDED: SCI/SPI/I2C configuration] |
| Nivel MSL | — | 3 (168 hours) |
| Estado RoHS | — | Compliant |
| Internal Oscillator | — | Yes (factory trimmed) |