MC9S08QD4MSC vs S9S08QD4J1VSC Comparación
Comparación detallada lado a lado de MC9S08QD4MSC por NXP Semiconductors y S9S08QD4J1VSC por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | MC9S08QD4MSC | S9S08QD4J1VSC |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Fin de vida | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1,18 | $1,31 |
| Core | S08 (HCS08), 8-bit | — |
| Core Architecture | CISC, enhanced HCS08 | HCS08 (S08 family) |
| Maximum CPU Frequency | 16 MHz | 16 MHz |
| Flash Memory | 4 KB (4K x 8) | — |
| RAM | 256 B (0.256 KB) | 256 B |
| ADC | 4-channel, 10-bit | 8-channel 10-bit |
| Number of I/Os | 6 | — |
| Tensión de alimentación | [DATA_NEEDED: supply voltage range] | — |
| Temperatura de funcionamiento | [DATA_NEEDED: operating temperature range] | -40C to +105C |
| Encapsulado | 8-SOIC | 8-pin SOIC (SOIC-8) |
| Tipo de montaje | Surface Mount | Surface Mount |
| Series | S08QD (9S08QD4 series) | — |
| Debug Interface | Single-wire background debug (BDM active in STOP when ENBDM set) | Background debug (single wire) + on-chip breakpoints |
| Moisture Sensitivity Level | [DATA_NEEDED: MSL level] | — |
| Estado RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| Estado del ciclo de vida | End of Life (per NXP product page) | — |
| CPU Bit Width | — | 8-bit |
| Program Memory (Flash) | — | 4 KB (4K x 8) |
| Supply Voltage (VDD) | — | 2.7 V to 5.5 V |
| Timers | — | TPM (16-bit) + MTIM (8-bit) |
| AEC-Q100 | — | Qualified (automotive) |
| Instruction Set | — | HC08 + BGND |
| Nivel MSL | — | MSL3 (per SOIC-8 standard) |