MC9S08SH16MTJR vs MC9S08SH16MTJ Comparación
Comparación detallada lado a lado de MC9S08SH16MTJR por NXP Semiconductors y MC9S08SH16MTJ por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MC9S08SH16MTJR - 8-bit S08 MCU, 16KB Flash, 40MHz, 20-TSSOP | NXP
MC9S08SH16MTJR ✓ ActivoNXP Semiconductors
MC9S08SH16MTJ - 8-bit MCU 16KB Flash 40MHz | NXP Semiconductors
MC9S08SH16MTJ ✗ Fin de vidaComparación de especificaciones
| Parámetro | MC9S08SH16MTJR | MC9S08SH16MTJ |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Activo | Fin de vida |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $2,18 | $2,95 |
| Core Processor | S08 (CISC, HCS08 instruction set) | S08 (HCS08) 8-bit CISC |
| Core Size | 8-bit | 8-bit |
| Maximum CPU Frequency | 40 MHz bus / 20 MHz core performance | — |
| Program Memory (Flash) | 16 KB (16K x 8) | — |
| RAM Size | 1 KB (1K x 8) | [DATA_NEEDED: RAM size] |
| EEPROM Size | Not present | — |
| Number of I/O Pins | 17 | — |
| Supply Voltage Range | 2.7 V to 5.5 V | 2.7 V to 5.5 V |
| Rango de temperatura de funcionamiento | [DATA_NEEDED: operating temperature] | — |
| Encapsulado | 20-pin TSSOP (5V-tolerant I/O) | 20-TSSOP (0.173 inch, 4.40 mm width) |
| ADC | 16-channel, 10-bit | — |
| Analog Comparators | Yes (on-chip) | — |
| Connectivity | I2C, LINbus, SCI, SPI | — |
| Peripherals | LVD, POR, PWM, WDT | — |
| Tipo de montaje | Surface Mount (Tape & Reel) | Surface Mount |
| Estado RoHS | Compliant | — |
| Frecuencia de reloj máxima | — | 40 MHz |
| Flash Memory | — | 16 KB (16K x 8) |
| ADC Resolution | — | 10-bit |
| ADC Channels | — | 16-channel |
| Interrupt/Reset Sources | — | up to 32 |
| Instruction Set | — | HC08 with added BGND instruction |
| Debug Interface | — | Single-wire background debug interface |
| On-chip Debug Module | — | ICE, 2 comparators, 9 trigger modes, 8-deep FIFO |
| Temperatura de funcionamiento | — | -40C to +125C (automotive grade) |
| Terminal Form | — | Gull Wing |
| Packaging | — | Tube |