MC9S08SH4CFK vs MC9S08SH4MFK Comparación
Comparación detallada lado a lado de MC9S08SH4CFK por NXP Semiconductors y MC9S08SH4MFK por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MC9S08SH4MFK - 8-bit HCS08 MCU 4KB Flash 40MHz QFN-24 | NXP
MC9S08SH4MFK ✓ ActivoComparación de especificaciones
| Parámetro | MC9S08SH4CFK | MC9S08SH4MFK |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Fin de vida | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $0,00 | $2,15 |
| Product Type | 8-bit S08SH microcontroller | — |
| Processor Core | HCS08 CPU | — |
| Frecuencia de reloj máxima | 40 MHz | — |
| Flash Memory | 4 KB (4K x 8) | — |
| Ancho del bus de datos | 8 bit | — |
| RAM Memory | 256 B | — |
| Supply Voltage Range | 2.7 V to 5.5 V | 2.7 V to 5.5 V |
| ADC Resolution | 10 bit | — |
| ADC Channel Count | 12 channels | — |
| Interrupt and Reset Sources | Up to 32 sources | — |
| Integrated Peripherals | Timers and ADC | — |
| Operating Application Range | Low-end 5 V embedded applications | — |
| Encapsulado | 24-QFN-EP, 4 mm x 4 mm | — |
| Package Code | HVQCCN | — |
| Terminal Count | 24 terminals | — |
| Tipo de montaje | No-lead surface mount | Surface Mount |
| Temperature Grade | Industrial | — |
| Process Technology | 0.25 µm | — |
| Power Consumption | Low-power operation | — |
| Estado del ciclo de vida | End of Life | — |
| Core | — | HCS08 (8-bit) |
| Program Memory Size | — | 4 KB (4K x 8) Flash |
| RAM Size | — | 256 B |
| Maximum CPU Clock | — | 40 MHz |
| Number of I/O Pins | — | 17 |
| Encapsulado / Carcasa | — | 24-VFQFN Exposed Pad (4x4 mm) |
| ADC | — | 12-channel, 10-bit, 2.5 us conversion |
| Oscillator Type | — | Internal |
| Interrupt/Reset Sources | — | Up to 32 |
| Instruction Set | — | HC08 with BGND instruction |
| Packaging | — | Tray |
| Temperatura de funcionamiento | — | -40 C to +85 C (industrial, [DATA_NEEDED: confirm exact grade]) |
| Compliance | — | RoHS compliant ([DATA_NEEDED: confirm exact status]) |