MC9S12DB128MPVE vs MC9S12DJ128MPVE Comparación
Comparación detallada lado a lado de MC9S12DB128MPVE por NXP Semiconductors y MC9S12DJ128MPVE por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MC9S12DB128MPVE - 16-Bit HCS12 MCU, 128KB Flash, 25MHz | NXP
MC9S12DB128MPVE ✓ ActivoComparación de especificaciones
| Parámetro | MC9S12DB128MPVE | MC9S12DJ128MPVE |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Activo | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $18,40 | $19,25 |
| Core Architecture | HCS12 (CPU12), 16-bit | HCS12 (16-bit CISC) |
| Maximum CPU Clock | 25 MHz | 25 MHz (50 MHz internal bus via PLL, see datasheet) |
| Program Memory (FLASH) | 128 KB (128K x 8) | — |
| Data Memory (RAM) | 8 KB (8K x 8) | — |
| Number of I/O Pins | 91 | — |
| Oscillator Type | Internal | — |
| Encapsulado / Carcasa | 112-LQFP (20x20 mm) | — |
| Tipo de montaje | Surface Mount (Gull Wing) | Surface Mount |
| Terminal Form | GULL WING | — |
| Number of Terminals | 112 | — |
| Package Code | LQFP | — |
| Package Shape | SQUARE | — |
| Temperature Grade | AUTOMOTIVE | — |
| Packaging | Tray | — |
| Estado RoHS | Compliant | Compliant |
| Program Memory (Flash) | — | 128 KB (128K x 8) |
| RAM | — | 8 KB |
| EEPROM | — | 2 KB |
| Tensión de alimentación | — | 2.35 V to 2.75 V (single 2.5V nominal) |
| Digital I/O Pins | — | 59 |
| ADC | — | 2x 8-channel, 10-bit |
| PWM Channels | — | 8 |
| SCI (UART) | — | 2 |
| SPI | — | 1 |
| I2C (Inter-IC Bus) | — | 1 |
| Encapsulado | — | 112-LQFP (20x20 mm) |
| Temperatura de funcionamiento | — | -40C to +125C (automotive grade) |
| Nivel MSL | — | [DATA_NEEDED: MSL level per JEDEC J-STD-020] |
| Debug Interface | — | BDM (Background Debug Mode) |