MC9S12DG128MPV vs MC912DT128ACPVE Comparación
Comparación detallada lado a lado de MC9S12DG128MPV por NXP Semiconductors y MC912DT128ACPVE por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MC9S12DG128MPV - 16-bit HCS12 MCU 128KB Flash 112-LQFP | NXP
MC9S12DG128MPV ObsoleteNXP Semiconductors
MC912DT128ACPVE - 16-Bit HC12 MCU 128KB Flash | NXP 112-LQFP
MC912DT128ACPVE ✓ ActivoComparación de especificaciones
| Parámetro | MC9S12DG128MPV | MC912DT128ACPVE |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Obsolete | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $0,00 | $43,76 |
| Core Processor | HCS12 | — |
| Core Size | 16-Bit | — |
| Architecture | CISC | — |
| Speed | 25 MHz | — |
| Program Memory Size | 128KB (128K x 8) | — |
| Program Memory Type | FLASH | — |
| RAM Size | 8K x 8 | 8 KB (8K x 8) |
| EEPROM Size | 2K x 8 | 2 KB |
| Number of I/O | 91 | — |
| Connectivity | CANbus, I2C, SCI, SPI | — |
| Peripherals | PWM, WDT | — |
| ADC Resolution | 10-bit | — |
| Tensión de alimentación | 2.5V / 5V | 5 V (typical) |
| Encapsulado / Carcasa | 112-LQFP (20 x 20 mm) | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Part Status | Obsolete | — |
| Series | HCS12 (MC9S12D family) | — |
| Product Type | — | 16-bit Microcontroller (MCU) |
| Core Architecture | — | CPU12 (HC12 / HCS12 CISC) |
| Program Memory (Flash) | — | 128 KB (128K x 8) |
| Frecuencia de reloj máxima | — | 8 MHz |
| Number of I/O Pins | — | 67 |
| Encapsulado | — | 112-LQFP (20 x 20 mm) |
| CAN Modules | — | 3 x CAN 2.0 A/B (DT128A variant) |
| Serial Interfaces | — | 2 x SCI (UART), 1 x SPI, 1 x I2C |
| Timers / PWM | — | Enhanced Capture Timer (ECT), 4 PWM channels |
| ADC | — | Dual 8/10-bit ADC |
| Temperatura de funcionamiento | — | -40 C to +105 C |
| Nivel MSL | — | 3 (168 hours) |
| Estado RoHS | — | Compliant |
| Debug Interface | — | Background Debug Mode (BDM), single-wire |