MC9S12DP512CPVE vs MC9S12DJ128BCPV Comparación
Comparación detallada lado a lado de MC9S12DP512CPVE por NXP Semiconductors y MC9S12DJ128BCPV por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MC9S12DJ128BCPV - 16-bit 25MHz HCS12 MCU 128KB Flash | NXP
MC9S12DJ128BCPV ✓ ActivoComparación de especificaciones
| Parámetro | MC9S12DP512CPVE | MC9S12DJ128BCPV |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $0,00 | $10,05 |
| Product Type | 16-bit HCS12 CISC microcontroller | — |
| Maximum Operating Frequency | 25 MHz | — |
| Internal Flash Memory | 512 KB | — |
| Internal RAM | 12 KB | — |
| EEPROM | 4 KB | 2 KB |
| ADC | Two 8-channel, 10-bit ADCs | 10-bit, 8 channels |
| Serial Communication Interfaces | 2 asynchronous serial communication interfaces | — |
| Enhanced Capture Timer | 8-channel IC/OC enhanced capture timer | — |
| Pulse-Width Modulator | 8-channel PWM | — |
| General-Purpose I/O | 91 pins | — |
| Encapsulado | 112-pin LQFP (20x20) | 112-LQFP (20x20 mm) |
| Core Architecture | HCS12, CISC | — |
| Operating Supply | 2.5 V / 5 V | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Series | MC9S12 | — |
| Tipo de memoria | Flash | — |
| Automotive Positioning | MC9S12D family designed for automotive multiplexing applications | — |
| Core | — | HCS12 (16-bit CISC) |
| CPU Speed | — | 25 MHz |
| Program Memory | — | 128 KB (128K x 8) Flash |
| RAM | — | 8 KB |
| Operating Voltage | — | 2.5 V / 5 V |
| Number of I/O | — | 91 (approximate, see datasheet) |
| CAN Controllers | — | 2 (msCAN 2.0A/B) |
| SCI / SPI / I2C | — | 2 SCI, 1 SPI, 1 I2C |
| PWM Channels | — | 8 |
| Timers | — | 16-bit, multiple channels |
| Temperatura de funcionamiento | — | -40C to +85C (industrial) or +125C automotive, see datasheet |
| Estado RoHS | — | Compliant (lead-free, per NXP product page) |
| Debug Interface | — | BDM (Background Debug Mode) |