MC9S12DT256VPVE vs MC9S12A256CFUE Comparación
Comparación detallada lado a lado de MC9S12DT256VPVE por NXP Semiconductors y MC9S12A256CFUE por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MC9S12DT256VPVE - 16-bit HCS12 MCU, 256KB Flash, 112-LQFP | NXP
MC9S12DT256VPVE Nrnd
Comparación de especificaciones
| Parámetro | MC9S12DT256VPVE | MC9S12A256CFUE |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | NRND | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $25,87 | $47,08 |
| Core | HCS12 (16-bit CISC) | — |
| Maximum Bus Frequency | 25 MHz | — |
| Program Memory (Flash) | 256 KB | — |
| RAM | 12 KB | — |
| EEPROM | 4 KB | — |
| Encapsulado | 112-LQFP (20x20 mm) | 80-QFP (14x14 mm) |
| Operating Voltage | 2.5 V core / 5.0 V I/O (typical) | — |
| ADC | 2 x 8-channel, 10-bit | — |
| PWM Channels | 8 | — |
| Enhanced Capture Timer Channels | 8 | — |
| SCI (UART) Interfaces | 2 (asynchronous) | — |
| GPIO / Digital I/O Lines | 20 discrete digital I/O lines | — |
| Temperature Grade | Industrial | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Estado RoHS | Compliant (verify per lot) | [DATA_NEEDED: RoHS compliance status] |
| Debug Interface | Single-wire BDM (Background Debug Mode) | — |
| Nivel MSL | [DATA_NEEDED: MSL Level] | — |
| Lead-Free | Yes | — |
| Core Architecture | — | HCS12 16-bit CISC |
| Bus Frequency | — | 25 MHz |
| Flash Memory | — | 256 KB (256K x 8) |
| Tensión de alimentación | — | 2.5 V / 5 V (per Arrow listing) |
| Temperatura de funcionamiento | — | -40C to +85C |
| Application Segment | — | Automotive (per Arrow listing) |
| Core Series | — | S12A (Barracuda, MOS13 per Mouser) |
| ADC Resolution | — | 10-bit |
| Ancho del bus de datos | — | 16-bit |
| Programming Interface | — | BDM (Background Debug Mode) |
| RAM Size | — | [DATA_NEEDED: on-chip RAM size] |
| EEPROM Size | — | [DATA_NEEDED: on-chip EEPROM size] |
| CAN Channels | — | [DATA_NEEDED: number of CAN modules] |