MC9S12XD256MAL vs MC9S12XDT512MAL Comparación
Comparación detallada lado a lado de MC9S12XD256MAL por NXP Semiconductors y MC9S12XDT512MAL por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MC9S12XD256MAL - 16-bit 256KB Flash HCS12X MCU 112-LQFP | NXP
MC9S12XD256MAL ✓ ActivoNXP Semiconductors
MC9S12XDT512MAL - 16-bit HCS12X MCU 512KB Flash 80MHz LQFP-112 | NXP
MC9S12XDT512MAL NrndComparación de especificaciones
| Parámetro | MC9S12XD256MAL | MC9S12XDT512MAL |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Activo | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $17,85 | $14,20 |
| Core | HCS12X (CISC, 16-bit) | — |
| CPU Clock Speed | 80 MHz | — |
| Program Memory | 256 KB Flash | 512 KB Flash |
| RAM | 12 KB | 20 KB |
| EEPROM | 4 KB | — |
| Tensión de alimentación | 2.35 V to 2.75 V (core) / 5 V (I/O tolerant) | 2.5 V / 5 V |
| Temperatura de funcionamiento | -40 °C to +125 °C (automotive grade) | -40C to +125C |
| Co-processor | XGATE RISC, 200 MHz equivalent | — |
| I/O Ports | 119 | — |
| ADC | 16-channel, 12-bit, 2.5 µs conversion | 8/10-bit (channels [DATA_NEEDED]) |
| CAN | 5 x msCAN modules | — |
| PWM | 8-channel | — |
| Timers | 8-channel 16-bit | — |
| SPI | 2 | — |
| I2C | 2 | — |
| SCI/UART | 3 | — |
| Encapsulado | 112-LQFP (20 x 20 mm) | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Temperature Grade | Automotive | — |
| Estado RoHS | Compliant | [DATA_NEEDED: rohs status] |
| Core Processor | — | HCS12X |
| Core Size | — | 16-bit |
| Core Architecture | — | CISC |
| Maximum CPU Speed | — | 80 MHz |
| Connectivity | — | CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI |
| Peripherals | — | LVD, POR, PWM, WDT |
| Number of I/O | — | [DATA_NEEDED: number of I/O pins] |
| Package Type | — | 112-LQFP (20x20 mm) |
| Series | — | MC9S12 / S12XD |
| Process Technology | — | TSMC3 (automotive qualified) |
| Boundary-Scan Debug | — | BDM + JTAG/Nexus |
| Lifecycle | — | NRND (Not Recommended for New Designs) |