MC9S12XDT256VAA vs MC9S12DT256MPVE Comparación
Comparación detallada lado a lado de MC9S12XDT256VAA por NXP Semiconductors y MC9S12DT256MPVE por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MC9S12DT256MPVE - 16-bit HCS12 MCU, 256KB Flash, 112-LQFP | NXP
MC9S12DT256MPVE NrndComparación de especificaciones
| Parámetro | MC9S12XDT256VAA | MC9S12DT256MPVE |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | NRND | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $9,05 | $14,36 |
| Core | HCS12X (16-bit CISC) | HCS12 (16-bit CISC) |
| CPU Speed | 80 MHz | — |
| Program Memory (Flash) | 256 KB (256K x 8) | 256 KB |
| RAM | 12 KB | 12 KB |
| Data EEPROM | 4 KB | — |
| ADC | 10-bit, 8 channels | 2 x 10-bit, 8 channels each (16 channels total) |
| CAN Controllers | 2 x CAN 2.0A/B | — |
| SCI / SPI / I2C | Yes | — |
| XGATE Coprocessor | Yes (80 MHz) | — |
| Operating Voltage | 2.35 V to 5.5 V (typical 2.5V/5V) | — |
| Encapsulado | 80-QFP (14x14 mm) | 112-LQFP (20x20 mm) |
| Tipo de montaje | Surface Mount | Surface Mount |
| Temperatura de funcionamiento | -40C to +105C (automotive) | -40C to +125C (automotive grade) |
| Nivel MSL | [DATA_NEEDED: MSL rating] | — |
| Estado RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| Maximum CPU Frequency | — | 25 MHz |
| EEPROM | — | 4 KB |
| Ancho del bus de datos | — | 16-bit |
| Tensión de alimentación | — | 2.35 V to 2.75 V (regulated core) |
| I/O Pins | — | 91 |
| Timers | — | 8-channel Enhanced Capture Timer (ECT) |
| Communication Interfaces | — | 2 x SCI (UART), 2 x SPI, 1 x I2C, 1 x CAN (MSCAN 2.0A/B) |
| Debug Interface | — | Background Debug Mode (BDM) + JTAG |
| Estado del ciclo de vida | — | NRND (Not Recommended for New Designs) |