MC9S12XEQ384CAG vs MC9S12XDT512CAG Comparación

Comparación detallada lado a lado de MC9S12XEQ384CAG por NXP Semiconductors y MC9S12XDT512CAG por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.

NXP Semiconductors
MC9S12XEQ384CAG MC9S12XEQ384CAG - 16-bit 50MHz MCU 384KB Flash | NXP

MC9S12XEQ384CAG - 16-bit 50MHz MCU 384KB Flash | NXP

MC9S12XEQ384CAG ✓ Activo
NXP Semiconductors
MC9S12XDT512CAG MC9S12XDT512CAG - 16-bit 80MHz 512KB Flash MCU | NXP

MC9S12XDT512CAG - 16-bit 80MHz 512KB Flash MCU | NXP

MC9S12XDT512CAG Nrnd

Comparación de especificaciones

Parámetro MC9S12XEQ384CAG MC9S12XDT512CAG
Marca NXP Semiconductors NXP Semiconductors
Categoría Microcontrollers Microcontrollers
Estado del ciclo de vida Activo NRND
Estado del stock In Stock In Stock
Precio unitario (USD) $0,00 $85,00
Core Processor HCS12X (16-bit CISC) HCS12X (CPU12X)
Core Size 16-bit 16-bit
Bus Speed 50 MHz —
Co-processor XGATE RISC co-processor —
Flash Memory 384 KB (384K x 8) —
RAM Size 24K x 8 [DATA_NEEDED: RAM size]
EEPROM Hardware-emulated EEPROM (programmable, flexible) —
ADC Resolution 12-bit [DATA_NEEDED: ADC resolution]
ADC Conversion Time 3 us —
Timers Enhanced Capture Timer (ECT), Periodic Interrupt Timer (PIT), Real Time Interrupt (RTI) —
Memory Protection MPU with supervisor/user modes —
I/O Ports [DATA_NEEDED: I/O Ports count] —
Temperatura de funcionamiento -40C to +85C (TA) [DATA_NEEDED: operating temperature range]
Tipo de montaje Surface Mount Surface Mount
Encapsulado 144-LQFP (20x20 mm) 144-LQFP (20x20 mm)
Packaging Tray —
Tensión de alimentación [DATA_NEEDED: Supply Voltage] 2.35 V to 2.75 V
Lifecycle Stage Active —
Speed — 80 MHz
Program Memory Type — FLASH
Program Memory Size — 512 KB (512K x 8)
I/O Count — 119
Architecture — HCS12X (CISC, upward compatible with HCS12)
Family Series — 9S12X (S12XD)
Technology — CMOS
Target Application — Automotive multiplexing
Life Cycle Stage — ACTIVE (per datasheet listings); NRND per NXP product page
Connectivity — CAN, SCI, SPI, I2C [DATA_NEEDED: exact peripheral count]
EEPROM Size — [DATA_NEEDED: EEPROM size]

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