MCF52256VN80 vs MCF51JE256VML Comparación
Comparación detallada lado a lado de MCF52256VN80 por NXP Semiconductors y MCF51JE256VML por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MCF52256VN80 - 32-Bit ColdFire V2 MCU 256KB Flash 80MHz | NXP
MCF52256VN80 ⚠ Última compra
Comparación de especificaciones
| Parámetro | MCF52256VN80 | MCF51JE256VML |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Última compra | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $18,15 | $0,00 |
| Series | ColdFire V2 MCF5225x | — |
| Core Architecture | ColdFire V2 (32-bit RISC, 68000-derived) | — |
| Core / Data Width | 32-Bit | — |
| Maximum CPU Clock | 80 MHz | — |
| Program Memory Size | 256 KB (256K x 8) Flash | — |
| RAM Size | 32 KB [DATA_NEEDED: confirm exact size from datasheet] | — |
| Tensión de alimentación | 3.0 V to 3.6 V | 2.5 V or 3.3 V |
| Temperatura de funcionamiento | -40 C to +85 C (industrial) [DATA_NEEDED: commercial vs industrial grade] | — |
| Number of I/O Pins | 96 [DATA_NEEDED: confirm pin count from datasheet] | — |
| Connectivity | EBI/EMI, Ethernet, I2C, SPI, UART, USB OTG, CAN | CANbus, USB OTG, I2C, SCI, SPI, EBI/EMI |
| Peripherals | DMA, PWM, WDT, 10/100 Ethernet MAC, USB 2.0 FS OTG, CAN 2.0B | LVD, PWM, WDT |
| Encapsulado / Carcasa | 144-MAPBGA (13x13 mm) | — |
| Tipo de montaje | Surface Mount | — |
| Nivel MSL | 3 (168 hours) [DATA_NEEDED] | — |
| Estado RoHS | [DATA_NEEDED: confirm RoHS compliance status] | [DATA_NEEDED: RoHS status] |
| Lead Free / Halogen Free | [DATA_NEEDED] | — |
| ECC RAM Supported | No | — |
| Core | — | ColdFire V1 |
| Processor Architecture | — | 32-bit |
| Maximum Frequency | — | 50 MHz |
| Flash Memory | — | 256 KB |
| Flash Organization | — | 256K x 8 |
| RAM | — | 32 KB |
| Encapsulado | — | 104-MAPBGA (10 x 10 mm) |
| Number of I/O | — | 69 |
| Program Memory Type | — | Flash |
| Low-Power Operation | — | Ultra-low-power operation |
| Measurement Feature | — | High measurement accuracy |
| Manufacturer | — | NXP USA Inc. |
| Estado del ciclo de vida | — | Active |
| Rango de temperatura de funcionamiento | — | [DATA_NEEDED: operating temperature range] |
| REACH Status | — | [DATA_NEEDED: REACH status] |
| Automotive AEC-Q100 Status | — | [DATA_NEEDED: AEC-Q100 status] |