MCF52277CVM160J vs MCF5372LCVM240J Comparación
Comparación detallada lado a lado de MCF52277CVM160J por NXP Semiconductors y MCF5372LCVM240J por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MCF5372LCVM240J - ColdFire V3 240MHz 32-Bit MPU | NXP | 196-LBGA
MCF5372LCVM240J NrndComparación de especificaciones
| Parámetro | MCF52277CVM160J | MCF5372LCVM240J |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Activo | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $14,85 | $25,10 |
| Core Architecture | ColdFire V2 (32-bit RISC) | — |
| Frecuencia de reloj máxima | 166.67 MHz | 240 MHz |
| Program Memory | ROMless (external memory required) | — |
| Internal SRAM | 128 KB | — |
| Instruction/Data Cache | 8 KB configurable | — |
| LCD Controller | Integrated (supports TFT up to SVGA) | — |
| Touchscreen Controller | Integrated 4-wire resistive | — |
| Ethernet MAC | 10/100 Mbps with on-chip PHY | — |
| USB Interface | USB 2.0 Full-Speed On-The-Go | — |
| CAN Interface | FlexCAN | — |
| UART Channels | 3 | — |
| I2C Channels | 2 | — |
| SPI Channels | 2 | — |
| External Bus Interface | Yes (32-bit) | — |
| Debug Interface | BDM + JTAG | — |
| Encapsulado | 196-ball MAP-BGA (15 x 15 mm) | — |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Temperatura de funcionamiento | -40C to +85C (industrial) | [DATA_NEEDED: industrial temperature grade confirmed by 'J' suffix; full range not in provided web data] |
| Estado RoHS | Compliant | [DATA_NEEDED: explicit RoHS statement not in provided web data] |
| Supply Voltage (Core) | 1.5 V nominal | — |
| Supply Voltage (I/O) | 3.3 V nominal | — |
| Core | — | ColdFire V3 (MCF537x) |
| Ancho del bus de datos | — | 32-bit |
| Architecture | — | Variable-length RISC (ColdFire) |
| Program Memory Type | — | ROMless (external boot memory required) |
| Encapsulado / Carcasa | — | 196-LBGA (MAP-BGA, 15x15 mm) |
| Number of I/O | — | [DATA_NEEDED: number of GPIO pins not in provided web data] |
| Tensión de alimentación | — | [DATA_NEEDED: core and I/O voltage not in provided web data] |
| Peripherals | — | Ethernet MAC, USB, UART, timers (per MCF5372 family) |
| External Memory Interface | — | External SDRAM/NOR Flash bus |
| Nivel MSL | — | [DATA_NEEDED: MSL rating not in provided web data] |
| Estado del ciclo de vida | — | NRND (Not Recommended for New Designs) |