MCF5234CVM150J vs MCF5235CVM150 Comparación
Comparación detallada lado a lado de MCF5234CVM150J por NXP Semiconductors y MCF5235CVM150 por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | MCF5234CVM150J | MCF5235CVM150 |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Obsolete | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $17,10 | $0,00 |
| Core | ColdFire V2 | — |
| Ancho del bus de datos | 32 bit | — |
| Frecuencia de reloj máxima | 150 MHz | 150 MHz |
| On-chip SRAM | 64 KB | — |
| External Memory Support | ROMless (SRAM/Flash/SDRAM external) | — |
| Program Memory Type | ROMless | ROM-less |
| Maximum I/O Count | 97 | — |
| Encapsulado / Carcasa | 256-MAPBGA (17x17 mm) | — |
| Tipo de montaje | Surface Mount | Surface mount |
| Ethernet MAC | 10/100 Mbps Fast Ethernet (MII/RMII) | 10/100 Ethernet MAC |
| CAN Controllers | 2x CAN 2.0B | — |
| UART | 3x | — |
| I2C | 2x | — |
| QSPI | 1x | — |
| DMA Channels | 16-channel | — |
| Hardware Encryption | ColdFire eMAC (AES/DES/3DES) | — |
| Tensión de alimentación | 1.5 V core / 3.3 V I/O | — |
| Temperatura de funcionamiento | -40C to +85C (industrial) [DATA_NEEDED: exact temp grade] | — |
| Nivel MSL | 3 [DATA_NEEDED: official JEDEC MSL rating] | — |
| Estado RoHS | [DATA_NEEDED: verify per NXP product page] | [DATA_NEEDED: RoHS Status] |
| Product Type | — | 32-bit ColdFire V2 integrated microprocessor |
| Processor Core | — | ColdFire V2 |
| Architecture Width | — | 32 bit |
| Internal SRAM | — | 64 KB |
| Enhanced Time Processing Unit | — | 16-channel eTPU |
| Security Feature | — | Hardware-accelerated encryption |
| Communications Peripherals | — | Integrated communications peripherals |
| Encapsulado | — | 256-map BGA, 17 mm x 17 mm |
| Package Family | — | BGA surface-mount package |
| Product Category | — | Microcontroller / integrated microprocessor |
| Manufacturer Lifecycle Status | — | NRND |
| Operating Voltage Range | — | [DATA_NEEDED: Operating Voltage Range] |
| Rango de temperatura de funcionamiento | — | [DATA_NEEDED: Operating Temperature Range] |
| External Memory Interfaces | — | [DATA_NEEDED: External Memory Interfaces] |
| REACH Status | — | [DATA_NEEDED: REACH Status] |