MCF5272VF66J vs MCF5270VM100 Comparación
Comparación detallada lado a lado de MCF5272VF66J por NXP Semiconductors y MCF5270VM100 por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MCF5272VF66J - ColdFire V2 66MHz 32-bit MPU 196-LBGA | NXP
MCF5272VF66J ✗ Fin de vidaComparación de especificaciones
| Parámetro | MCF5272VF66J | MCF5270VM100 |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Fin de vida | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $9,95 | $23,12 |
| Manufacturer | NXP Semiconductors (formerly Freescale) | — |
| Part Status | Obsolete / End of Life | — |
| Core Processor | ColdFire V2 | ColdFire V2 (MCF527x) |
| Core Size | 32-Bit | 32-Bit |
| Frecuencia de reloj máxima | 66 MHz | — |
| Program Memory Size | 16 KB (4K x 32) ROM | [DATA_NEEDED: Program Memory Size] |
| Number of I/O | 32 | 61 |
| Connectivity | EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB | [DATA_NEEDED: Connectivity interfaces] |
| Peripherals | DMA, WDT (Watchdog Timer) | [DATA_NEEDED: Peripherals] |
| Encapsulado | 196-LBGA (15x15 mm) | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Temperatura de funcionamiento | [DATA_NEEDED: industrial -40C to +85C vs 0C to +70C grade] | [DATA_NEEDED: Operating Temperature] |
| Tensión de alimentación | [DATA_NEEDED: core and I/O rail voltages] | [DATA_NEEDED: Supply Voltage] |
| Ancho del bus de datos | 32-bit | — |
| Estado RoHS | Non-Compliant (per third-party catalog; verify with NXP PCN) | — |
| Lead-Free | [DATA_NEEDED: confirm with manufacturer PCN] | — |
| Nivel MSL | [DATA_NEEDED: moisture sensitivity level] | — |
| Speed | — | 100 MHz |
| Program Memory Type | — | ROMless |
| RAM Size | — | 64K x 8 |
| Oscillator Type | — | External |
| Encapsulado / Carcasa | — | 196-LBGA (15x15 mm MAPBGA) |
| Packaging | — | Tray |
| Supplier Device Package | — | 196-MAPBGA |
| Estado del ciclo de vida | — | NRND (Not Recommended for New Designs) |