MCF5275LCVM166 vs MCF5282CVM80 Comparación
Comparación detallada lado a lado de MCF5275LCVM166 por NXP Semiconductors y MCF5282CVM80 por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | MCF5275LCVM166 | MCF5282CVM80 |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | NRND | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $19,55 | $17,85 |
| Core Architecture | ColdFire V2 (32-bit, variable-length RISC) | — |
| Maximum Core Clock | 166 MHz | — |
| On-chip SRAM | 64 KB | — |
| Program Memory | ROMless (external memory required) | — |
| Tensión de alimentación | 3.3 V I/O, internal core rail generated on-chip | — |
| Ethernet | 10/100 MAC with MII/RMII | — |
| USB | USB 2.0 full-speed device/host | — |
| UART | 2 | 3 UARTs |
| I2C | 2 | 2 I2C buses |
| DMA Channels | 16 (eDMA) | — |
| Timers | 4 x 32-bit | 4-channel 32-bit |
| External Bus | 16-bit EBI (SDRAM/SRAM/ROM) | — |
| Encapsulado | 196-LBGA (15x15 mm) | 256-MAPBGA (17x17 mm) |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Temperatura de funcionamiento | [DATA_NEEDED: operating temperature range] | -40C to +85C (industrial) |
| Estado RoHS | Compliant | [DATA_NEEDED: RoHS compliance] |
| Core | — | ColdFire V2 (32-bit) |
| Maximum Core Frequency | — | 80 MHz |
| Program Flash | — | 512 KB (512K x 8) |
| SRAM | — | [DATA_NEEDED: SRAM size in KB] |
| Operating Voltage | — | 3.0 V to 3.6 V |
| Ethernet MAC | — | 10/100 Mbps with MII/RMII |
| CAN Controllers | — | 2x CAN 2.0B |
| ADC | — | 8-channel 10-bit |
| Serial Peripheral Interface | — | QSPI |
| External Memory Bus | — | Yes (SDRAM/FP/ROM controller) |