MCF5281CVM66 vs MCF5214CVM66 Comparación
Comparación detallada lado a lado de MCF5281CVM66 por NXP Semiconductors y MCF5214CVM66 por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MCF5281CVM66 - ColdFire V2 MCU 32-bit 66MHz 256KB Flash 256-MAPBGA | NXP
MCF5281CVM66 NrndNXP Semiconductors
MCF5214CVM66 - ColdFire V2 32-bit MCU, 256KB Flash, 66MHz | NXP
MCF5214CVM66 ✓ ActivoComparación de especificaciones
| Parámetro | MCF5281CVM66 | MCF5214CVM66 |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | NRND | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $32,77 | $11,85 |
| Core Architecture | ColdFire V2 (M68k family) | ColdFire V2 (32-bit RISC) |
| Core Frequency | 66 MHz | — |
| Bit Width | 32-bit | — |
| Program Memory (Flash) | 256 KB | — |
| RAM | [DATA_NEEDED: RAM size] | — |
| Tensión de alimentación | 3.3 V (I/O), 1.5 V (internal core) | — |
| Encapsulado | 256-MAPBGA (17x17 mm) | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount (BGA) |
| Rango de temperatura de funcionamiento | [DATA_NEEDED: operating temperature range] | — |
| Ethernet MAC | 10/100 (MII/RMII) | 10/100 Mbps (FEC) with MII |
| CAN Module | FlexCAN (CAN 2.0B) | — |
| UART | 3 | 3 |
| QSPI | Yes | 1 (queued, up to 4 peripherals) |
| I2C | Yes | 2 |
| ADC | [DATA_NEEDED: ADC resolution and channel count] | 8 channels, 12-bit SAR |
| eTPU Timer Co-processor | Yes | — |
| DMA Channels | 4 | — |
| Estado del ciclo de vida | NRND (Not Recommended for New Designs) | — |
| Estado RoHS | Compliant | Compliant |
| Core Clock Speed | — | 66 MHz |
| Program Memory Size | — | 256 KB (256K x 8) Flash |
| Program Memory Type | — | FLASH, interleaved and securable |
| RAM Size | — | 64 KB (64K x 8) SRAM |
| Supply Voltage (Vcc/Vdd) | — | 2.7 V to 3.6 V |
| Temperatura de funcionamiento | — | -40 C to +85 C (TA) |
| Encapsulado / Carcasa | — | 256-MAPBGA (17x17 mm) |
| USB | — | USB 2.0 Full-Speed OTG |
| DMA | — | 4-channel, 32-bit |
| Timers | — | 4 x 32-bit (including 4-channel DMA timer) |
| External Bus | — | FlexBus (16-bit data, glueless SRAM/NOR/ASIC) |
| Nivel MSL | — | 3 (per JEDEC J-STD-020) |