MCF5327CVM240J vs MCF5329CVM240 Comparación
Comparación detallada lado a lado de MCF5327CVM240J por NXP Semiconductors y MCF5329CVM240 por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | MCF5327CVM240J | MCF5329CVM240 |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Activo | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $15,95 | $25,60 |
| Core Architecture | ColdFire V3 (32-bit RISC, variable-length) | ColdFire V3 (VLRISC) |
| Frecuencia de reloj máxima | 240 MHz | 240 MHz |
| Performance | 211 MIPS | — |
| Internal SRAM | 32 KB | — |
| Program Memory | ROMless (external memory interface) | — |
| Number of I/O Lines | 94 | 94 |
| Oscillator Type | External | External |
| Encapsulado | 196-LBGA (MAPBGA) 15x15 mm | 256-LBGA (MAPBGA) |
| Tipo de montaje | Surface Mount | Surface Mount |
| Operating Temperature Grade | Industrial | — |
| Integrated LCD Controller | Yes (TFT, up to 800x600) | — |
| Ethernet MAC | Yes (10/100) | — |
| USB | USB 2.0 Full-Speed OTG | USB 2.0 Full-Speed OTG |
| CAN | Yes | — |
| JTAG / BDM Debug | Yes | — |
| Estado RoHS | Compliant | Compliant |
| Core Bit Width | — | 32-bit |
| On-chip SRAM | — | 32 KB |
| Unified Cache | — | 16 KB write-back |
| Program Memory Type | — | ROMless (external memory bus required) |
| Tensión de alimentación | — | 1.5 V core / 3.3 V I/O (typical, refer to datasheet) |
| Temperatura de funcionamiento | — | -40C to +85C (industrial) |
| LCD Controller | — | Integrated (TFT/STN, first integrated LCD on ColdFire) |
| Ethernet | — | 10/100 MAC integrated |
| Debug Interface | — | JTAG/BDM/OnCE |
| Packaging | — | Tray |