MCF5475VR200 vs MCF5470VR200 Comparación
Comparación detallada lado a lado de MCF5475VR200 por NXP Semiconductors y MCF5470VR200 por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | MCF5475VR200 | MCF5470VR200 |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | NRND | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $25,60 | $30,25 |
| Core | ColdFire V4E | — |
| Core Architecture | Harvard (separate instruction/data buses) | — |
| Bit Width | 32-bit | — |
| Maximum Core Frequency | 200 MHz | — |
| Performance | [DATA_NEEDED: Dhrystone MIPS rating] | — |
| MMU | Yes (hardware memory management unit) | Yes |
| FPU | Yes (hardware floating-point unit) | Yes |
| L1 Cache | Integrated (instruction + data) | — |
| Tensión de alimentación de funcionamiento | 1.5 V core / 3.3 V I/O | — |
| Ethernet MACs | 2x 10/100 Mbps | — |
| PCI Controller | 32-bit PCI 2.2 | — |
| USB | USB 2.0 full-speed device | USB 2.0 Full-Speed Device/Host |
| UART | 4 | — |
| I2C | 2 | — |
| SSI/SPI | 2 | — |
| Encryption Accelerator | SEC (DES/3DES/AES/SHA) | DES / 3DES / AES / SHA-1 / MD5 |
| Encapsulado | 388-pin PBGA (27x27 mm, 1.0 mm ball pitch) | 388-PBGA, 27x27 mm, 1.00 mm pitch |
| Rango de temperatura de funcionamiento | [DATA_NEEDED: confirm from datasheet - likely 0C to +70C commercial or -40C to +85C extended] | — |
| Estado RoHS | [DATA_NEEDED: confirm from manufacturer declaration] | Compliant (lead-free) |
| Core Processor | — | ColdFire V4E |
| Core Size | — | 32-Bit Single-Core |
| Frecuencia de reloj máxima | — | 200 MHz |
| Operating Voltage (Core) | — | 1.5 V |
| Operating Voltage (I/O) | — | 2.5 V / 3.3 V |
| Program Memory Type | — | ROMless |
| On-chip SRAM | — | [DATA_NEEDED: total SRAM size in KB] |
| L1 Cache (I/D) | — | 32 KB / 32 KB |
| Ethernet | — | 2 × 10/100 MAC |
| PCI Bus | — | PCI 2.2, 32-bit, up to 66 MHz |
| CAN | — | 2 × CAN 2.0B |
| Tipo de montaje | — | Surface Mount |
| Temperatura de funcionamiento | — | 0°C to +70°C (Commercial) |
| Estado del ciclo de vida | — | NRND (Not Recommended for New Designs) |