MCF5475ZP266 vs MPC8245LVV266D Comparación
Comparación detallada lado a lado de MCF5475ZP266 por NXP Semiconductors y MPC8245LVV266D por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MPC8245LVV266D - 266MHz PowerQUICC II MPU | NXP | Networking
MPC8245LVV266D ✗ Fin de vidaComparación de especificaciones
| Parámetro | MCF5475ZP266 | MPC8245LVV266D |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | NRND | Fin de vida |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $52,10 | $48,90 |
| Core | ColdFire V4e (Version 4 Enhanced) | — |
| Core Architecture | 32-bit RISC (68000-derived) | — |
| Operating Frequency | 266 MHz | — |
| Dhrystone Performance | [DATA_NEEDED: MIPS rating] | — |
| MMU | Yes (full memory management unit) | — |
| FPU | Yes (hardware single-precision floating-point unit) | — |
| Program Memory Type | ROMless (external memory interface) | — |
| Ethernet MACs | 2 x 10/100 Mbps | — |
| PCI Interface | PCI 2.2 | — |
| Encryption Accelerator | Yes (IPsec/SSL/AES/3DES) | — |
| Operating Voltage (Core) | 1.5 V | — |
| Operating Voltage (I/O) | 2.5 V / 3.3 V | — |
| Encapsulado | 388-PBGA 27 x 27 mm | 352-TBGA (35x35 mm) |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Temperature Grade | Commercial | — |
| Terminal Form | Ball | — |
| Estado RoHS | [DATA_NEEDED: per datasheet] | RoHS compliant (lead-free) |
| Manufacturer | — | NXP USA Inc. |
| Part Family | — | PowerQUICC II (MPC82xx) |
| Processor Core | — | PowerPC MPC603e (32-bit Power Architecture) |
| Core Clock Speed | — | 266 MHz |
| Performance | — | 505.4 MIPS |
| Number of Cores | — | 1 |
| L1 Instruction Cache | — | 32 KB |
| L1 Data Cache | — | 32 KB |
| Core Voltage (Vcc) | — | 1.8 V |
| I/O Voltage | — | 3.3 V |
| Temperatura de funcionamiento | — | 0C to +105C (industrial, 'D' suffix) |
| Packaging | — | Tray |
| Integrated PCI Bridge | — | Yes, 32-bit / 66 MHz PCI |
| Memory Controller | — | DDR SDRAM |
| Estado del ciclo de vida | — | End of Life (per NXP product page) |