MK50DX256ZCLQ10 vs MK50DN512CLQ10 Comparación
Comparación detallada lado a lado de MK50DX256ZCLQ10 por NXP Semiconductors y MK50DN512CLQ10 por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MK50DX256ZCLQ10 - 100MHz Cortex-M4 MCU | NXP | Industrial Control
MK50DX256ZCLQ10 NrndNXP Semiconductors
MK50DN512CLQ10 - Kinetis K50 100MHz Cortex-M4 MCU 512KB | NXP
MK50DN512CLQ10 ✓ ActivoComparación de especificaciones
| Parámetro | MK50DX256ZCLQ10 | MK50DN512CLQ10 |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | NRND | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $0,00 | $10,21 |
| Architecture | 32-bit ARM Cortex-M4 | — |
| Maximum CPU Frequency | 100 MHz | 100 MHz |
| Flash Memory | 256 KB | — |
| SRAM | 64 KB | 128 KB |
| Product Type | ARM Microcontroller - MCU | — |
| Series | Kinetis K50 | — |
| Operating Voltage Variants | 1.8 V / 2.5 V / 3.3 V | — |
| USB Support | Full-Speed USB | — |
| Integrated Security | Security features specified in product information | — |
| Analog Measurement Engine | Integrated operational amplifiers and trans-impedance amplifiers | — |
| ADC | High-resolution ADC module specified in family description | — |
| DAC | DAC module specified in family description | — |
| Encapsulado | 144-LQFP | 144-pin LQFP (20 x 20 mm) |
| Package Dimensions | 20 mm x 20 mm | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Terminal Finish | Matte Tin (Sn) | — |
| Moisture Sensitivity Level | MSL 3 | — |
| Peak Reflow Temperature | 260 C | — |
| Maximum Time At Peak Reflow Temperature | 40 s | — |
| Estado del ciclo de vida | NRND | — |
| RoHS | [DATA_NEEDED: RoHS status] | — |
| REACH | [DATA_NEEDED: REACH status] | — |
| AEC-Q100 | [DATA_NEEDED: AEC-Q100 qualification] | — |
| Core Architecture | — | ARM Cortex-M4 with FPU and DSP |
| Dhrystone Performance | — | 1.25 MIPS per MHz |
| Program Flash Memory | — | 512 KB |
| Supply Voltage Range | — | 1.71 V to 3.6 V |
| Rango de temperatura de funcionamiento | — | -40 C to +85 C (industrial) |
| GPIO Count | — | 96 I/O |
| USB Controller | — | USB 2.0 Full-Speed, on-chip transceiver |
| ADC Channels | — | [DATA_NEEDED: number of ADC channels] |
| ADC Resolution | — | Dual 16-bit SAR with up to 24-bit effective via oversampling |
| DAC Resolution | — | 12-bit |
| Integrated Amplifiers | — | Operational amplifiers and trans-impedance amplifiers |
| Nivel MSL | — | [DATA_NEEDED: MSL level] |
| Estado RoHS | — | Compliant |
| Lead-Free | — | Yes |