MK50DX256ZCLQ10 vs MK50DX256CMC7 Comparación
Comparación detallada lado a lado de MK50DX256ZCLQ10 por NXP Semiconductors y MK50DX256CMC7 por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MK50DX256ZCLQ10 - 100MHz Cortex-M4 MCU | NXP | Industrial Control
MK50DX256ZCLQ10 Nrnd
Comparación de especificaciones
| Parámetro | MK50DX256ZCLQ10 | MK50DX256CMC7 |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | NRND | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $0,00 | $11,04 |
| Architecture | 32-bit ARM Cortex-M4 | — |
| Maximum CPU Frequency | 100 MHz | — |
| Flash Memory | 256 KB | — |
| SRAM | 64 KB | [DATA_NEEDED: SRAM size] |
| Product Type | ARM Microcontroller - MCU | — |
| Series | Kinetis K50 | — |
| Operating Voltage Variants | 1.8 V / 2.5 V / 3.3 V | — |
| USB Support | Full-Speed USB | — |
| Integrated Security | Security features specified in product information | — |
| Analog Measurement Engine | Integrated operational amplifiers and trans-impedance amplifiers | — |
| ADC | High-resolution ADC module specified in family description | 16-bit SAR ADC, multiple channels |
| DAC | DAC module specified in family description | 12-bit DAC |
| Encapsulado | 144-LQFP | 121-MAPBGA (8x8 mm) |
| Package Dimensions | 20 mm x 20 mm | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Terminal Finish | Matte Tin (Sn) | — |
| Moisture Sensitivity Level | MSL 3 | — |
| Peak Reflow Temperature | 260 C | — |
| Maximum Time At Peak Reflow Temperature | 40 s | — |
| Estado del ciclo de vida | NRND | — |
| RoHS | [DATA_NEEDED: RoHS status] | — |
| REACH | [DATA_NEEDED: REACH status] | — |
| AEC-Q100 | [DATA_NEEDED: AEC-Q100 qualification] | — |
| Core | — | ARM Cortex-M4 with FPU and DSP extensions |
| Core Architecture | — | ARM 32-bit |
| Frecuencia de reloj máxima | — | 72 MHz |
| Program Flash | — | 256 KB |
| FlexNVM (EEPROM emulation) | — | [DATA_NEEDED: FlexNVM size] |
| Tensión de alimentación | — | 1.8 V / 2.5 V / 3.3 V |
| Temperatura de funcionamiento | — | -40C to +85C (industrial, per K50 family) |
| USB | — | USB 2.0 Full-Speed Device/Host/OTG |
| Timers | — | FlexTimer + 16-bit timers (PWM, capture, quadrature decode) |
| Serial Interfaces | — | UART, SPI, I2C, I2S |
| Estado RoHS | — | Compliant |
| Nivel MSL | — | [DATA_NEEDED: MSL level] |
| Peripherals (general) | — | GPIO, DMA, RTC, low-leakage wake-up unit |