MMA2202EG vs MMA2301EG Comparación
Comparación detallada lado a lado de MMA2202EG por NXP Semiconductors y MMA2301EG por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | MMA2202EG | MMA2301EG |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Motion Sensors | Motion Sensors |
| Estado del ciclo de vida | NRND | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $10,85 | $9,95 |
| Tipo de sensor | Accelerometer, single-axis (X) | Accelerometer, single-axis (X) |
| Technology | MEMS, capacitive sense element | MEMS, silicon capacitive surface micromachined |
| Acceleration Range | ±56.3 g | — |
| Sensitivity | 38 mV/g to 42 mV/g | [DATA_NEEDED: sensitivity mV/g] |
| Tipo de salida | Analog, ratiometric voltage | Analog, ratiometric voltage |
| Zero-g Output (typ.) | 2.5 V (mid-supply) | — |
| Bandwidth | 400 Hz (4-pole low-pass filter) | 400 Hz (4-pole low-pass filter, factory trimmed) |
| Supply Voltage (VDD) | 4.75 V to 5.25 V | — |
| Supply Current (typ.) | [DATA_NEEDED: supply current] | — |
| Self-Test Pin | Yes (logic input) | — |
| Rango de temperatura de funcionamiento | -40 °C to +125 °C | — |
| Encapsulado | 16-pin SOIC | 16-SOIC (SOP-16 wide-body, 7.5 mm) |
| Tipo de montaje | Surface Mount | Surface Mount |
| Temperature Compensation | On-chip, factory trimmed | — |
| Estado RoHS | Compliant | RoHS Compliant |
| Lead Free Status | Lead Free | Lead Free – Compliant by Exemption |
| Rango de medición | — | ±225 g (full scale); 200 g nominal |
| Axis | — | X (single axis) |
| Tensión de alimentación | — | 5.0 V typical (ratiometric output) |
| Zero-g Output | — | [DATA_NEEDED: zero-g output voltage] |
| Filter Type | — | 4-pole low-pass (Bessel-type), internal |
| Temperatura de funcionamiento | — | −40 °C to +125 °C (automotive) |
| Signal Conditioning | — | Integrated ASIC; on-chip temperature compensation |
| External Components Required | — | None (zero-g, full-scale, and filter factory calibrated) |