MMA6261QR2 vs MMA6263QR2 Comparación
Comparación detallada lado a lado de MMA6261QR2 por NXP Semiconductors y MMA6263QR2 por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MMA6263QR2 - ±1.5g Dual-Axis Analog Accelerometer | NXP / Freescale
MMA6263QR2 ⚠ Última compraComparación de especificaciones
| Parámetro | MMA6261QR2 | MMA6263QR2 |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Motion Sensors | Motion Sensors |
| Estado del ciclo de vida | Obsolete | Última compra |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $3,85 | $5,45 |
| Tipo de sensor | Accelerometer, dual-axis (X, Y) | Accelerometer, Dual Axis (X, Y) |
| Sensing Technology | Capacitive MEMS | — |
| Acceleration Range | ±1.5 g | ±1.5 g (g-select to ±6 g) |
| Number of Axes | 2 (X, Y) | — |
| Tipo de salida | Analog voltage, ratiometric | Analog, ratiometric voltage |
| Bandwidth | 300 Hz | 900 Hz sensor bandwidth |
| Supply Voltage (VDD) | 2.7 V to 3.6 V | — |
| Corriente de alimentación | 1.5 mA (typical) | — |
| Sensitivity | factory-set, ratiometric | 740 mV/g to 860 mV/g (typ. 800 mV/g at 3.3 V) |
| Zero-g Offset | factory-set | — |
| Filter | 1-pole low-pass, factory-set | — |
| Self-Test | Yes (per axis) | Logic-level input on each axis |
| Temperatura de funcionamiento | -20 C to +85 C | — |
| Encapsulado | 16-QFN-EP (6x6 mm) HQCCN | 16-QFN-EP (6x6 mm) with exposed pad |
| Tipo de montaje | Surface Mount | Surface Mount |
| Estado RoHS | RoHS Compliant (contains lead, lead-free terminal finish) | RoHS Compliant |
| Recuento de pines | 16 | — |
| Tensión de alimentación | — | 3.3 V nominal (range per datasheet) |
| Low-Pass Filter | — | 1-pole on-chip, ~400 Hz cutoff |
| Zero-g Output (Typ) | — | 1.65 V (mid-supply) |
| Temperature Compensation | — | On-chip factory trimmed |
| Lead Status | — | Contains Lead (legacy package) |
| Operating Principle | — | Capacitive micromachined (MEMS) |