MPC8248VRMIBA vs MPC8248ZQMIBA Comparación
Comparación detallada lado a lado de MPC8248VRMIBA por NXP Semiconductors y MPC8248ZQMIBA por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MPC8248VRMIBA - PowerQUICC II 266MHz 32-Bit MPU | NXP
MPC8248VRMIBA ⚠ Última compraNXP Semiconductors
MPC8248ZQMIBA - PowerQUICC II 266MHz MPU | NXP 516-PBGA
MPC8248ZQMIBA ⚠ Última compraComparación de especificaciones
| Parámetro | MPC8248VRMIBA | MPC8248ZQMIBA |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Última compra | Última compra |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $49,95 | $25,85 |
| Core Architecture | PowerPC G2_LE (32-bit) | PowerPC G2_LE (603e-class) |
| Core Frequency | 266 MHz | — |
| Performance | 505.4 MIPS | — |
| Series | MPC82xx PowerQUICC II | — |
| Number of Cores | 1 | 1 |
| Co-Processors | CPM (Communications), SEC (Security) | — |
| Process Technology | 0.13 µm HiP7 | 0.13 µm (HiP7) CMOS |
| Core Supply Voltage | 1.5 V | — |
| I/O Supply Voltage | 3.3 V | — |
| Encapsulado | 516-ball TEPBGA (27x27 mm) | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Temperatura de funcionamiento | 0 °C to +105 °C | [DATA_NEEDED: operating temperature range] |
| Memory Controller | DRAM, SDRAM | — |
| PCI Interface | 64-bit PCI | — |
| Ethernet Support | Dual 10/100/1000 Mbps MAC (via CPM) | — |
| USB Support | USB 1.1 host | — |
| Estado RoHS | RoHS Compliant (Lead-Free) | No (non-RoHS legacy product) |
| Manufacturer | — | NXP Semiconductors (formerly Freescale Semiconductor) |
| Processor Series | — | PowerQUICC II (MPC82xx) |
| Ancho del bus de datos | — | 32 bit |
| Frecuencia de reloj máxima | — | 266 MHz |
| Tensión de alimentación | — | 3.3 V |
| Package Type | — | 516-PBGA (TEBGA) |
| Package Dimensions | — | 27 x 27 mm |
| Nivel MSL | — | [DATA_NEEDED: MSL level] |
| On-chip Features | — | Memory controller, PCI bridge, DMA, dual I2C, dual UART, timers, CPM communications module |
| Instruction Set | — | Power Architecture 32-bit |