MPC8250AVRIHBC vs MPC8250ACZQIHBC Comparación
Comparación detallada lado a lado de MPC8250AVRIHBC por NXP Semiconductors y MPC8250ACZQIHBC por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MPC8250AVRIHBC - PowerQUICC II MPC82xx 200MHz MPU BGA-516 | NXP
MPC8250AVRIHBC ⚠ Última compraNXP Semiconductors
MPC8250ACZQIHBC - PowerQUICC II MPU 200MHz 516-PBGA | NXP
MPC8250ACZQIHBC ObsoleteComparación de especificaciones
| Parámetro | MPC8250AVRIHBC | MPC8250ACZQIHBC |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Última compra | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $21,40 | $99,50 |
| Architecture | PowerPC G2 (PowerQUICC II) | — |
| Core | PowerPC 32-bit, 1 core | — |
| Ancho del bus de datos | 64-bit | 64-Bit |
| Instruction Set | RISC | — |
| Core Clock Speed | 200 MHz | — |
| Supply Voltage (Core) | 1.8 V | 1.8 V |
| Supply Voltage (I/O) | 3.3 V | 3.3 V |
| Package Type | BGA (Plastic, Lead-Free) | TEPBGA / Plastic BGA |
| Package Code | 516-PBGA | — |
| Package Dimensions | 27 x 27 mm, 2.25 mm height | 27 x 27 mm |
| Ball Pitch | 1.0 mm | 1.0 mm |
| Recuento de pines | 516 | 516 |
| Rango de temperatura de funcionamiento | -40C to +105C (Industrial) | — |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Family | MPC82xx (PowerQUICC II) | — |
| Communications Peripherals | FCC, MCC, SCC, SMC controllers (CPM) | — |
| Estado RoHS | Compliant (Lead-Free PBGA) | — |
| Manufacturer | — | NXP Semiconductors |
| Series | — | PowerQUICC II |
| Core Processor | — | PowerPC G2 |
| Core Architecture | — | PowerPC 603e, 32-Bit RISC |
| Clock Speed | — | 200 MHz |
| Number of Cores | — | 1 (CPU) + 1 CPM |
| Temperatura de funcionamiento | — | -40C to +105C (industrial) |
| Process Technology | — | 0.25 um CMOS |
| Instruction Cache | — | 32 KB |
| Data Cache | — | 32 KB |
| Integrated Peripheral | — | PCI bridge, CPM (communications processor module) |
| Nivel MSL | — | 3 (168 hours) |
| Lead Free | — | Yes (per datasheet package code) |