MPC8313EVRAGDB vs MPC8313EVRAFFB Comparación
Comparación detallada lado a lado de MPC8313EVRAGDB por NXP Semiconductors y MPC8313EVRAFFB por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MPC8313EVRAGDB - PowerQUICC II Pro 400MHz MPU | NXP Semiconductors
MPC8313EVRAGDB ObsoleteNXP Semiconductors
MPC8313EVRAFFB - PowerQUICC II Pro e300c3 MPU 333MHz | NXP
MPC8313EVRAFFB ✓ ActivoComparación de especificaciones
| Parámetro | MPC8313EVRAGDB | MPC8313EVRAFFB |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Obsolete | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $17,90 | $42,85 |
| Processor Series | MPC83xx (PowerQUICC II Pro) | MPC83xx (PowerQUICC II Pro) |
| Core | PowerPC e300c3 | — |
| Core Architecture | 32-bit RISC | PowerPC e300c3 |
| Ancho del bus de datos | 32 bit | 32-bit |
| Maximum CPU Clock | 400 MHz | — |
| Number of Cores | 1 | — |
| Process Technology | 0.09 um CMOS | — |
| Supply Voltage - I/O | 1.8V / 2.5V / 3.3V | — |
| Encapsulado | 516-TEPBGA (27x27 mm) with Exposed Pad | — |
| Number of Pins/Balls | 516 balls | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount (BGA) |
| Temperatura de funcionamiento | -40C to +85C (Industrial) | — |
| Integrated Ethernet MACs | 2 (10/100/1000 Mbps eTSECs) | — |
| PCI Express | 2 x PCIe interfaces | [DATA_NEEDED: PCIe lane count] |
| USB Interface | USB 2.0 Host/Device | [DATA_NEEDED: USB revision] |
| Cryptography Engine | Hardware IPsec, AES, DES/3DES, Kasumi | — |
| Security Enabled | Yes (E suffix) | — |
| Estado RoHS | non-compliant per legacy Freescale datasheet | — |
| Memory Controller | DDR1/DDR2 SDRAM | DDR1/DDR2 (up to 256 MB addressable) |
| Pin/Ball Count | 516 | — |
| Manufacturer | — | NXP Semiconductors (formerly Freescale) |
| Part Status | — | Active |
| Core Count | — | 1 |
| Maximum CPU Frequency | — | 333 MHz |
| Package Type | — | 516-TEPBGA (27 mm x 27 mm) with exposed die pad |
| Rango de temperatura de funcionamiento | — | [DATA_NEEDED: operating temperature range] |
| Encryption Engine | — | Yes (AES, DES, 3DES, IPsec) |
| Ethernet Controllers | — | [DATA_NEEDED: ethernet port count and speed] |
| RoHS | — | Details per manufacturer (status not confirmed by web data snippet) |
| Supplier Device Package | — | 516-TEPBGA |