MPC8313ZQADDB vs MPC8313ZQADDC Comparación
Comparación detallada lado a lado de MPC8313ZQADDB por NXP Semiconductors y MPC8313ZQADDC por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MPC8313ZQADDB - PowerPC e300c3 MPU 267MHz 516-TEPBGA | NXP
MPC8313ZQADDB ✓ ActivoNXP Semiconductors
MPC8313ZQADDC - PowerQUICC II Pro 266MHz MPU 516-TEPBGA | NXP
MPC8313ZQADDC ✓ ActivoComparación de especificaciones
| Parámetro | MPC8313ZQADDB | MPC8313ZQADDC |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $24,50 | $21,40 |
| Manufacturer | NXP Semiconductors (formerly Freescale) | NXP Semiconductors / Freescale |
| Series | MPC83xx | MPC83xx PowerQUICC II Pro |
| Core | PowerPC e300c3 | — |
| Number of Cores | 1 | — |
| Ancho del bus de datos | 32-bit | 32-bit |
| Frecuencia de reloj máxima | 267 MHz | — |
| Encapsulado / Carcasa | 516-TEPBGA (27x27 mm) | — |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Temperatura de funcionamiento | [DATA_NEEDED: Operating temperature range] | 0 °C to +105 °C |
| Encryption | Without Encryption (W/O ENCR) | — |
| Revision | REV 2.1 | — |
| Memory Controller | Integrated DDR/DDR2 | — |
| Ethernet | Dual Gigabit Ethernet MACs | — |
| PCI Express | Yes (integrated) | — |
| USB | USB 2.0 (integrated) | — |
| Estado RoHS | [DATA_NEEDED: RoHS compliance] | [DATA_NEEDED: RoHS status] |
| Core Architecture | — | PowerPC e300c3 |
| Core Count | — | 1 |
| Max Core Frequency | — | 267 MHz |
| Process Technology | — | 0.09 µm CMOS |
| Operating Voltage (Core) | — | 1.8 V |
| Operating Voltage (DDR I/O) | — | 2.5 V / 1.8 V |
| Operating Voltage (Standard I/O) | — | 3.3 V |
| Package Type | — | 516-TEPBGA (27x27 mm) |
| Ball Count | — | 516 |
| Integrated Memory Controller | — | DDR1/DDR2 up to 266 MHz |
| Integrated Ethernet | — | 10/100/1000 Mbps (3x eTSEC) |
| USB Interface | — | USB 2.0 High-Speed (Host/Device) |
| PCI Interface | — | PCI 32-bit/66 MHz + mini-PCI |
| Security Engine | — | AES / DES / 3DES |
| Nivel MSL | — | [DATA_NEEDED: MSL level] |