MPC8321CVRADDC vs MPC8272CVRMIBA Comparación
Comparación detallada lado a lado de MPC8321CVRADDC por NXP Semiconductors y MPC8272CVRMIBA por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MPC8321CVRADDC - 266MHz PowerQUICC II Pro MPU, 516-PBGA | NXP
MPC8321CVRADDC ✓ ActivoNXP Semiconductors
MPC8272CVRMIBA - 266MHz PowerQUICC II MPU | NXP | SoC
MPC8272CVRMIBA ✗ Fin de vidaComparación de especificaciones
| Parámetro | MPC8321CVRADDC | MPC8272CVRMIBA |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Activo | Fin de vida |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $20,75 | $62,80 |
| Manufacturer | NXP Semiconductors (formerly Freescale) | — |
| Product Category | Microprocessors (MPU) | — |
| Processor Series | MPC8xxx / MPC83xx | — |
| Core | PowerPC e300c2 | — |
| Core Architecture | 32-bit Power Architecture | — |
| Core Clock Speed | 266 MHz | — |
| Number of Cores | 1 | — |
| Process Technology | 90 nm CMOS | 0.13 um |
| Tensión de alimentación | 1.8 V / 2.5 V / 3.3 V | 3.3 V |
| Package Type | 516-ball TEBGA (Plastic Ball Grid Array) | — |
| Package Dimensions | 27 mm x 27 mm | — |
| Rango de temperatura de funcionamiento | -40C to +105C | — |
| Integrated Memory Controller | DDR1 / DDR2 SDRAM | — |
| Integrated Peripherals | QUICC Engine, PCI, USB 2.0, UART, I2C, GPIO, TDM/HDLC | PCI 2.2, USB, UTOPIA, CPM, SEC 2.0, 2x UART, I2C, SPI |
| Tipo de montaje | Surface Mount | Surface Mount |
| Estado RoHS | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED: rohs status] |
| Encryption / SEC Block | Not included (non-E variant) | — |
| Architecture | — | PowerPC G2_LE (32-bit) |
| Family | — | PowerQUICC II (MPC82xx) |
| Core Count | — | 1 |
| Core Clock Frequency | — | 266 MHz |
| Performance | — | 505.4 MIPS |
| Temperatura de funcionamiento | — | -40C to +105C |
| Encapsulado | — | 516-PBGA (27x27 mm) |
| Memory Interface | — | 32-bit DDR SDRAM with ECC |
| Ethernet | — | 10/100/1000 MAC via CPM |
| Security Engine | — | SEC 2.0 (DES, 3DES, AES, SHA-1, MD-5) |
| Instruction Cache | — | 16 KB |
| Data Cache | — | 16 KB |
| Nivel MSL | — | [DATA_NEEDED: MSL level] |