MPC8548ECPXAUJC vs MPC8572ECPXAVND Comparación

Comparación detallada lado a lado de MPC8548ECPXAUJC por NXP Semiconductors y MPC8572ECPXAVND por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.

NXP Semiconductors
MPC8548ECPXAUJC MPC8548ECPXAUJC - PowerPC e500 MPU 1.333GHz 783-BGA | NXP

MPC8548ECPXAUJC - PowerPC e500 MPU 1.333GHz 783-BGA | NXP

MPC8548ECPXAUJC Obsolete
NXP Semiconductors
MPC8572ECPXAVND MPC8572ECPXAVND - 1.5GHz Dual-Core PowerPC e500 MPU | NXP

MPC8572ECPXAVND - 1.5GHz Dual-Core PowerPC e500 MPU | NXP

MPC8572ECPXAVND ✓ Activo

Comparación de especificaciones

Parámetro MPC8548ECPXAUJC MPC8572ECPXAVND
Marca NXP Semiconductors NXP Semiconductors
Categoría Microcontrollers Microcontrollers
Estado del ciclo de vida Obsolete Activo
Estado del stock In Stock In Stock
Precio unitario (USD) $189,90 $365,00
Series MPC85xx MPC85xx (PowerQUICC III)
Core Processor PowerPC e500 PowerPC e500
Number of Cores / Bus Width 1 Core, 32-Bit —
Core Frequency 1.333 GHz —
Co-Processors / DSP Signal Processing; SPE, Security; SEC —
RAM Controllers DDR, DDR2, SDRAM —
Graphics Acceleration No —
Display & Interface Controllers [DATA_NEEDED: specific display controller block] —
Ethernet 10/100/1000 Mbps (4 MACs) —
SATA [DATA_NEEDED: SATA revision and port count] —
USB [DATA_NEEDED: USB version and port count] —
PCI Express Yes, 3 ports —
Serial RapidIO Yes, 2 ports —
Security Engine SEC (DES, 3DES, AES, RSA, ECC) —
Encapsulado 783-BBGA, FCBGA —
Tipo de montaje Surface Mount Surface Mount
Temperatura de funcionamiento -40C to +105C (industrial) -40C to +105C (Extended Temp, AVND suffix)
Part Status Obsolete —
Estado RoHS [DATA_NEEDED: per NXP product page] [DATA_NEEDED: RoHS compliance]
Lead-Free [DATA_NEEDED: per NXP product page] [DATA_NEEDED: lead-free status]
Manufacturer — NXP USA Inc.
Number of Cores — 2
Core Architecture — 32-Bit
Maximum CPU Clock — 1.5 GHz
Encapsulado / Carcasa — 1023-BFBGA, FCBGA (33x33 mm)
Memory Controller — DDR2/DDR3 with ECC (per datasheet)
Ethernet Interfaces — Multiple Gigabit Ethernet (per datasheet)
High-Speed Serial — PCI Express and/or Serial RapidIO SerDes (per datasheet)
Hardware Acceleration — QUICC Engine, security acceleration (per datasheet)
Packaging — Tray

Hojas de datos y recursos

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