MPC857DSLZQ50B vs MPC857TZQ50B Comparación
Comparación detallada lado a lado de MPC857DSLZQ50B por NXP Semiconductors y MPC857TZQ50B por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MPC857DSLZQ50B - PowerQUICC MPC8xx MPU 50MHz 357-PBGA | NXP
MPC857DSLZQ50B ⚠ Última compraNXP Semiconductors
MPC857TZQ50B - PowerQUICC MPC8xx 32-Bit MPU 50MHz 357-PBGA | NXP
MPC857TZQ50B ⚠ Última compraComparación de especificaciones
| Parámetro | MPC857DSLZQ50B | MPC857TZQ50B |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Última compra | Última compra |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $25,90 | $40,10 |
| Core Architecture | Power Architecture (PowerPC) - MPC8xx | PowerPC, 32-bit RISC |
| Core Count | 1 | — |
| Ancho del bus de datos | 32-bit | — |
| Maximum Core Frequency | 50 MHz | — |
| Encapsulado | 357-PBGA (25x25 mm) | — |
| Temperatura de funcionamiento | 0 C to +105 C | [DATA_NEEDED: temperature grade range] |
| Tipo de montaje | Surface Mount | Surface Mount |
| Tensión de alimentación | [DATA_NEEDED: Vcore/Vio nominal] | [DATA_NEEDED: Vcore/Vio levels] |
| On-chip Cache | 4 KB instruction + 4 KB data (per MPC8xx family) | — |
| Communications Processor Module (CPM) | Yes (SCC, SMC, SPI, I2C, UART) | — |
| Integrated Ethernet MAC | 10/100 Mbps | — |
| External Memory Interface | SDRAM / SRAM / EPROM / Flash | — |
| JTAG | IEEE 1149.1 test access port | — |
| Family | PowerQUICC MPC8xx | — |
| Nivel MSL | 3 | [DATA_NEEDED: MSL rating] |
| Estado RoHS | [DATA_NEEDED: verify per lot] | [DATA_NEEDED: RoHS compliance status] |
| Manufacturer | — | NXP Semiconductors (formerly Freescale) |
| Series | — | PowerQUICC MPC8xx |
| Number of Cores | — | 1 |
| Core Clock Speed | — | 50 MHz |
| Process Technology | — | 0.32 um CMOS |
| Package Type | — | 357-PBGA (Plastic Ball Grid Array) |
| Package Dimensions | — | 25 mm x 25 mm |
| On-chip Peripherals | — | CPM (Communications Processor Module), SIU, DMA, Timers, Serial |
| External Memory Bus | — | 32-bit, with memory controller |
| Packaging | — | Tray |
| Estado del ciclo de vida | — | Last Time Buy / Mature |