MPC857TZQ80B vs MPC857TZQ100B Comparación
Comparación detallada lado a lado de MPC857TZQ80B por NXP Semiconductors y MPC857TZQ100B por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | MPC857TZQ80B | MPC857TZQ100B |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | NRND | NRND |
| Processor Type | MPC8xx PowerQUICC, 1 Core, 32-Bit | — |
| Core Architecture | PowerPC | PowerPC, 32-bit |
| Core Frequency | 80 MHz | 100 MHz |
| Supply Voltage (I/O) | 3.3 V | — |
| Number of Cores | 1 | 1 |
| Ancho del bus de datos | 32-Bit | — |
| Encapsulado / Carcasa | 357-PBGA (25x25 mm) | — |
| Packaging | Tray | — |
| Lead Free Status | Contains Lead | — |
| Estado RoHS | RoHS (per distributor listing) | — |
| Series | PowerQUICC, MPC8xx | PowerQUICC MPC8xx |
| Terminal Form | Ball | — |
| Number of Terminals | 357 | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Temperature Grade | Other (industrial) | — |
| Manufacturer | — | NXP Semiconductors (originally Freescale) |
| Process Technology | — | 0.32 micrometer CMOS |
| Encapsulado | — | 357-PBGA (25x25 mm) |
| Supply Voltage (Core/IO) | — | [DATA_NEEDED: exact core and I/O supply rails] |
| On-chip Communications | — | Multi-PHY support, UTOPIA master/slave, SPI, I2C |
| UTOPIA Support | — | Full-duplex, master and slave (split bus) |
| External Memory Bus | — | 32-bit address/data (MPC8xx system bus) |
| Temperatura de funcionamiento | — | [DATA_NEEDED: operating temperature range] |
| Lead Status | — | Contains lead / RoHS non-compliant (per Zeanoit listing) |
| Packaging (Tray / Reel) | — | Tray (per FindIC datasheet listing) |
| Distributors In Stock | — | DigiKey (Rochester Electronics), Mouser, LCSC, Octopart |