MPC859TVR133A vs MPC859PVR133A Comparación
Comparación detallada lado a lado de MPC859TVR133A por NXP Semiconductors y MPC859PVR133A por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MPC859TVR133A - 133MHz PowerQUICC MPU, 32-Bit | NXP | 357-PBGA
MPC859TVR133A ✗ Fin de vidaNXP Semiconductors
MPC859PVR133A - 133MHz PowerQUICC MPC8xx MPU | NXP | Networking
MPC859PVR133A NrndComparación de especificaciones
| Parámetro | MPC859TVR133A | MPC859PVR133A |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Fin de vida | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $54,10 | $49,90 |
| Manufacturer | NXP Semiconductors (formerly Freescale Semiconductor) | NXP Semiconductors (formerly Freescale) |
| Series | PowerQUICC, MPC8xx family | PowerQUICC MPC8xx |
| Core Architecture | Power Architecture (32-bit) | Power Architecture, 32-bit RISC |
| Core / Series Name | MPC8xx | — |
| Frecuencia de reloj máxima | 133 MHz | — |
| Ancho del bus de datos | 32 bit | — |
| Number of Cores | 1 | — |
| Package Type | 357-PBGA (Plastic Ball Grid Array) | — |
| Package Dimensions | 25 x 25 mm | — |
| Temperatura de funcionamiento | 0C to +95C (commercial/industrial grade) | 0 °C to +95 °C (Commercial) |
| On-Chip Cache | 8 KB instruction / 8 KB data (per datasheet family) | — |
| Communication Channels | 4 SCC, 2 SMC, 1 FCC (typical MPC859T configuration) | — |
| Peripheral Interfaces | SPI, I2C, PCMCIA, IDMA, UART | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount (BGA) |
| Estado RoHS | See manufacturer PCN (legacy status) | — |
| Lifecycle | End-of-Life per NXP product page | — |
| Core Count | — | 1 |
| Core Speed | — | 133 MHz |
| Tensión de alimentación | — | 3.3 V |
| Process Technology | — | 0.18 µm CMOS |
| Encapsulado | — | 357-ball PBGA (25 x 25 mm) |
| Cache (I/D) | — | 4 Kbyte / 4 Kbyte |
| MMU | — | Yes (hardware memory management unit) |
| Communications Processor Module (CPM) | — | Integrated (4 SCC, 2 SMC, SPI, I²C) |
| Fast Ethernet Controllers | — | 3 |
| UTOPIA / PQM Interfaces | — | 2 |
| PCI Interface | — | Yes |
| Nivel de sensibilidad a la humedad (MSL) | — | [DATA_NEEDED: MSL level] |