MPC860ENVR50D4-FR vs MPC860TCVR50D4 Comparación

Comparación detallada lado a lado de MPC860ENVR50D4-FR por NXP Semiconductors y MPC860TCVR50D4 por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.

NXP Semiconductors
MPC860ENVR50D4-FR MPC860ENVR50D4-FR - 50MHz PowerQUICC MPU 357-BGA | NXP Semiconductors

MPC860ENVR50D4-FR - 50MHz PowerQUICC MPU 357-BGA | NXP Semiconductors

MPC860ENVR50D4-FR Obsolete
NXP Semiconductors
MPC860TCVR50D4 MPC860TCVR50D4 - 50MHz 32-Bit PowerQUICC MPU | NXP

MPC860TCVR50D4 - 50MHz 32-Bit PowerQUICC MPU | NXP

MPC860TCVR50D4 ✗ Fin de vida

Comparación de especificaciones

Parámetro MPC860ENVR50D4-FR MPC860TCVR50D4
Marca NXP Semiconductors NXP Semiconductors
Categoría Microcontrollers Microcontrollers
Estado del ciclo de vida Obsolete Fin de vida
Estado del stock In Stock In Stock
Precio unitario (USD) $76,80 $0,00
Manufacturer NXP Semiconductors (formerly Motorola) —
Part Family MPC8xx PowerQUICC —
Core Architecture PowerPC 603e-derived, 32-bit —
Core Frequency 50 MHz —
Operating Voltage 3.3 V —
Encapsulado 357-Ball PBGA (25 x 25 mm) 357-pin PBGA, 25 x 25 mm
Tipo de montaje Surface Mount (BGA) Surface mount
Number of Cores 1 —
L1 Instruction Cache 4 KB —
L1 Data Cache 4 KB —
Communications Processor Module (CPM) Yes (FCC x3, SCC x4, MCC x2, SPI, I2C) —
Ethernet MAC 10/100 Mbps integrated —
USB USB 1.1 device —
DMA Channels 4 —
Memory Controller SDRAM, DRAM, burst flash —
Rango de temperatura de funcionamiento [DATA_NEEDED: extended industrial -40C to +85C presumed, confirm via datasheet] —
Lead Free / RoHS Yes (per DigiKey listing) —
Packaging Tray Tray
Nivel MSL [DATA_NEEDED: confirm via JEDEC J-STD-020 floor life] —
Processor Type — MPC8xx PowerQUICC 32-bit microprocessor
Core Count — 1 core
Processor Architecture — RISC, 32-bit
Operating Speed — 50 MHz
Tensión de alimentación — 3.3 V
Process Technology — 0.32 micrometer
Package Type — 357-BBGA
Lead-Free Status — Lead free
Estado RoHS — RoHS compliant
Application Category — Communications and networking controllers
Temperatura de funcionamiento — [DATA_NEEDED: operating temperature range]
Memory Configuration — [DATA_NEEDED: internal and external memory configuration]
I/O Interfaces — [DATA_NEEDED: communications and peripheral interfaces]
Power Consumption — [DATA_NEEDED: power consumption conditions]
Clocking and Reset — [DATA_NEEDED: clock and reset requirements]
Pinout — [DATA_NEEDED: complete 357-ball assignment]

Hojas de datos y recursos

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