MPC880ZP80 vs MPC885ZP80 Comparación
Comparación detallada lado a lado de MPC880ZP80 por NXP Semiconductors y MPC885ZP80 por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MPC885ZP80 - PowerQUICC 32-Bit MPU, 80MHz, 357-BGA | NXP
MPC885ZP80 ⚠ Última compraComparación de especificaciones
| Parámetro | MPC880ZP80 | MPC885ZP80 |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Obsolete | Última compra |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $19,10 | $25,85 |
| Core Architecture | PowerPC (MPC8xx family) | Power Architecture (MPC8xx) |
| Ancho del bus de datos | 32-bit | — |
| Maximum Core Frequency | 80 MHz | — |
| Number of Cores | 1 | 1 |
| Instruction Cache | 4 KB | — |
| Data Cache | 4 KB | — |
| Ethernet MACs | 2 (10/100 Mbps Fast Ethernet Controller) | — |
| USB Interface | USB 1.1 (host + slave) | — |
| Serial Communications Controllers (SCC) | 2 (per datasheet family) | — |
| Serial Management Controllers (SMC) | 2 (per datasheet family) | — |
| PCMCIA Controller | Yes (2 ports) | — |
| Memory Controller | DRAM/Flash/SRAM, 32-bit | — |
| Operating Voltage - Core | [DATA_NEEDED: core voltage] | — |
| Operating Voltage - I/O | 3.3 V | — |
| Encapsulado | 357-PBGA (25x25 mm) | — |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Rango de temperatura de funcionamiento | [DATA_NEEDED: operating temperature range] | — |
| Process Technology | CMOS | 0.18 µm CMOS |
| Lead Free / RoHS | [DATA_NEEDED: RoHS status] | — |
| Nivel MSL | [DATA_NEEDED: MSL level] | [DATA_NEEDED: MSL rating] |
| Lifecycle | Obsolete (Rochester Electronics stocking) | — |
| Processor Type | — | MPC8xx PowerQUICC 32-Bit |
| Core Speed | — | 80 MHz |
| Operating Voltage | — | 3.3 V |
| Encapsulado / Carcasa | — | 357-BBGA (PBGA, 25 x 25 mm) |
| Packaging | — | Tray |
| Lead Free Status | — | Contains Lead |
| Estado RoHS | — | Non-Compliant (legacy product) |
| Bit Width | — | 32-Bit |
| Temperatura de funcionamiento | — | 0 °C to +95 °C (commercial) |
| On-chip Communications Module | — | CPM (SCC/SMC/SPI/I2C) |
| I/O Voltage | — | 3.3 V |