MPCZ565MVR56 vs MPC565CVR56 Comparación

Comparación detallada lado a lado de MPCZ565MVR56 por NXP Semiconductors y MPC565CVR56 por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.

NXP Semiconductors
MPCZ565MVR56 MPCZ565MVR56 - 32-bit Power Arch MCU, 1MB Flash, 40MHz | NXP

MPCZ565MVR56 - 32-bit Power Arch MCU, 1MB Flash, 40MHz | NXP

MPCZ565MVR56 Obsolete
NXP Semiconductors
MPC565CVR56 MPC565CVR56 - 32-Bit 56 MHz Automotive MCU | NXP

MPC565CVR56 - 32-Bit 56 MHz Automotive MCU | NXP

MPC565CVR56 Unknown

Comparación de especificaciones

Parámetro MPCZ565MVR56 MPC565CVR56
Marca NXP Semiconductors NXP Semiconductors
Categoría Microcontrollers Microcontrollers
Estado del ciclo de vida Obsolete Unknown
Estado del stock In Stock In Stock
Precio unitario (USD) $52,75 $0,00
Core Architecture Power Architecture (MPC500 family) —
Ancho del bus de datos 32-bit —
Program Memory Size 1 MB Flash —
RAM Size 64 KB [DATA_NEEDED: exact value] —
Frecuencia de reloj máxima 40 MHz —
Supply Voltage Range [DATA_NEEDED: Vdd/Vdd range] —
Rango de temperatura de funcionamiento -40C to +125C —
Encapsulado / Carcasa 388-ball PBGA —
Tipo de montaje Surface Mount Surface mount, ball-grid array
Number of I/O Pins [DATA_NEEDED: exact I/O count] —
Floating Point Unit Yes (IEEE 754) —
CAN Controllers 2 (CAN 2.0B) —
ADC Channels 40 (QADC) —
Timers 32 channels eMIOS + TPU [DATA_NEEDED: exact TPU count] —
Debug Interface JTAG / OnCE / BDM —
Nivel de sensibilidad a la humedad (MSL) 3 —
Peak Reflow Temperature 260C (40s max) —
Terminal Finish Tin Silver Copper (e1 per JESD-609) —
Automotive Grade Yes Automotive Grade
Process Technology 0.25 micron CMOS —
Architecture — Power Architecture, 32-bit
Processor Core — Single core
Product Family — MPC5xx / MPC500 family
Manufacturer Frequency Listing — 40 MHz
Distributor Frequency Listing — 56 MHz
Flash Memory — 1 MB, listed as 1M x 8 by distributor sources
Program Memory Type — Embedded Flash
Floating-Point Unit — Integrated floating-point unit
Peripheral Set — Advanced peripheral set
Temperatura de funcionamiento — -40 °C to +85 °C
Encapsulado — 388-PBGA
Package Ball Count — 388 balls
Package Dimensions — 27 mm x 27 mm
Supplier Inventory Listing — 5,664 pieces on Heisener listing
Unit Price Listing — $139.2941 per unit on Heisener listing
Estado RoHS — [DATA_NEEDED: RoHS status]
REACH Status — [DATA_NEEDED: REACH status]
AEC-Q100 Qualification — [DATA_NEEDED: AEC-Q100 qualification status]

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