MPX2100GP vs MPX53GP Comparación
Comparación detallada lado a lado de MPX2100GP por NXP Semiconductors y MPX53GP por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | MPX2100GP | MPX53GP |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Pressure Sensors | Pressure Sensors |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $10,40 | $6,10 |
| Pressure Type | Vented Gauge | Vented Gauge |
| Operating Pressure Range | 0 to 14.5 psi (0 to 100 kPa) | 0 kPa to 50 kPa (0 to 7.25 PSI) |
| Maximum Overpressure | 58.02 psi (400 kPa) | 175 kPa (25.38 PSI) |
| Tipo de salida | Wheatstone Bridge (analog voltage, ratiometric) | Wheatstone Bridge (analog voltage) |
| Full-Scale Span | 40 mV typical at 10 V supply | — |
| Offset | 0 mV minimum at 0 kPa | — |
| Tensión de alimentación | 10 V typical (ratiometric) | 3 V typical |
| Maximum Operating Current | 6 mA | — |
| Port Size | Male 0.19 in (4.93 mm) barbed tube | Male - 0.19 inch (4.93 mm) barbed tube |
| Port Style | Barbed | Barbed |
| Encapsulado | 4-SIP Module (Unibody through-hole) | — |
| Tipo de montaje | Through-Hole | — |
| Temperature Compensation | On-chip, calibrated | — |
| Temperatura de funcionamiento | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: operating temperature range] |
| Technology | Silicon piezoresistive, MEMS | — |
| Termination Style | PCB (SIP pins) | PCB (Through-Hole) |
| Estado RoHS | unknown | [DATA_NEEDED: RoHS status from datasheet] |
| Full-Scale Output | — | 60 mV at 3 V supply |
| Accuracy | — | -0.6% to +0.4% |
| Encapsulado / Carcasa | — | 4-SIP Module |
| Output Range | — | 20 mV to 80 mV (manufacturer sensitivity window) |
| Mounting Feature | — | Through-Hole Mount |
| Package Shape | — | Circular |