MPX2102AP vs MPX2202GP Comparación
Comparación detallada lado a lado de MPX2102AP por STMicroelectronics y MPX2202GP por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
STMicroelectronics
MPX2102AP - 100kPa Absolute Pressure Sensor 4-SIP | STMicroelectronics
MPX2102AP ✓ ActivoComparación de especificaciones
| Parámetro | MPX2102AP | MPX2202GP |
|---|---|---|
| Marca | STMicroelectronics | NXP Semiconductors |
| Categoría | Pressure Sensors | Pressure Sensors |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $9,50 | $24,80 |
| Pressure Type | Absolute | Vented Gauge |
| Operating Pressure Range | 14.5 PSI (100 kPa) | 0 kPa to 200 kPa (0 to 29.01 PSI) |
| Maximum Overload Pressure | 14.5 PSI (100 kPa) | [DATA_NEEDED: maximum overload pressure] |
| Port Type | Male - 0.19" (4.93 mm) Tube | — |
| Tipo de salida | Analog Wheatstone Bridge | — |
| Tensión de salida | 0 mV to 40 mV at 10 V excitation | 0 mV to 40 mV (at 10 V excitation) |
| Tensión de alimentación | 10 V (typical ratiometric) | 10 V DC nominal |
| Linearity | ±0.5% (typ) | — |
| Temperatura de funcionamiento | 0 °C to +85 °C | -40 C to +125 C [DATA_NEEDED: confirm from datasheet curves] |
| Encapsulado | 4-SIP Module (Unibody) | — |
| Tipo de montaje | Through-Hole | Through Hole |
| Diaphragm Technology | Silicon Piezoresistive | — |
| Response Time | [DATA_NEEDED: response time ms] | — |
| Estado RoHS | Compliant | [DATA_NEEDED: RoHS compliance] |
| Style | Tube Port | — |
| Corriente de alimentación | — | [DATA_NEEDED: supply current] |
| Port Size | — | Male, 0.19 in (4.93 mm) Tube |
| Encapsulado / Carcasa | — | 4-SIP Top Port Module |
| Termination Style | — | Through-Hole (PCB) |
| Accuracy | — | [DATA_NEEDED: linearity / accuracy specification] |
| Media Compatibility | — | Dry air or non-corrosive gases (per datasheet) |
| Compensation | — | On-chip temperature compensated and calibrated |