MPX2102DP vs MPX2100D Comparación
Comparación detallada lado a lado de MPX2102DP por NXP Semiconductors y MPX2100D por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MPX2102DP - 100kPa Differential Pressure Sensor, 4-SIP | NXP
MPX2102DP ⚠ Última compraComparación de especificaciones
| Parámetro | MPX2102DP | MPX2100D |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Pressure Sensors | Pressure Sensors |
| Estado del ciclo de vida | Última compra | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $9,85 | $17,80 |
| Tipo de sensor | Piezoresistive Pressure Sensor | — |
| Pressure Type | Differential (Dual Port) | Differential |
| Operating Pressure Range | 0 kPa to 100 kPa (0 PSI to 14.5 PSI) | 0 kPa to 100 kPa (0 to 14.5 psi) |
| Full-Scale Output | 0 mV to 40 mV at 10 V excitation | — |
| Supply Voltage (Excitation) | 10 V typical (max specified separately) | — |
| Port Size | Male, 0.19" (4.93 mm) tube, Dual | — |
| Rango de temperatura de funcionamiento | -40 °C to +125 °C | -40C to +125C [DATA_NEEDED: confirm exact range from datasheet] |
| Compensated Temperature Range | 0 °C to +85 °C | — |
| Encapsulado / Carcasa | 4-SIP Module (Unibody) | — |
| Termination Style | Through-Hole PCB | — |
| Tipo de salida | Analog Wheatstone Bridge (ratiometric mV) | Analog ratiometric Wheatstone bridge (millivolts) |
| Technology | On-chip Temperature Compensated Silicon | Silicon piezoresistive MEMS strain-gauge bridge |
| Linearity | [DATA_NEEDED: typical linearity %FS] | 0.1% to 0.3% typical [DATA_NEEDED: confirm] |
| Sensitivity | [DATA_NEEDED: mV/V typical] | — |
| Tipo de montaje | Through-Hole, Dual Vertical Port | Through-hole SIP module |
| Series | MPX2102 | — |
| Full-Scale Span (Typical) | — | 40 mV at 10 V excitation |
| Sensitivity (Nominal) | — | 0.4 mV/kPa |
| Supply Voltage (Recommended) | — | 10 V DC |
| Supply Voltage (Maximum) | — | 16 V DC |
| Pressure Port Configuration | — | Dual axial ports (differential) |
| Encapsulado | — | 4-SIP Unibody (UNIBODY4F), 2.54 mm pitch |
| Package Body Dimensions | — | 15.56 mm x 15.56 mm x 5.33 mm |
| On-Chip Temperature Compensation | — | Yes (factory laser-trimmed) |
| Estado RoHS | — | Compliant [DATA_NEEDED: confirm from NXP product page] |
| Diaphragm Material | — | Silicon [DATA_NEEDED: confirm] |