MPX5010GS vs MPX2010GS Comparación
Comparación detallada lado a lado de MPX5010GS por NXP Semiconductors y MPX2010GS por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | MPX5010GS | MPX2010GS |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Pressure Sensors | Pressure Sensors |
| Estado del ciclo de vida | Activo | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $10,85 | $15,95 |
| Pressure Type | Vented Gauge | Vented Gauge |
| Operating Pressure Range | 0 kPa to 10 kPa (0 to 1.45 PSI) | — |
| Maximum Overpressure | [DATA_NEEDED: maximum overpressure rating] | — |
| Tensión de alimentación de funcionamiento | 4.75 V to 5.25 V (5 V typical) | — |
| Corriente de alimentación | 5 mA typical | — |
| Rango de tensión de salida | 0.2 V to 4.7 V at 5 V supply | — |
| Accuracy | +/-2.5% of full-scale span | +/-1% (per data brief) |
| Response Time | 1.0 ms typical | — |
| Temperatura de funcionamiento | 0 C to +85 C (compensated) | -40C to +125C (per MPX2010 series datasheet) |
| Storage Temperature | -40 C to +125 C | — |
| Tipo de salida | Analog, ratiometric | Wheatstone Bridge (analog voltage) |
| Port Type | Male 0.19" (4.93 mm) tube, axial | — |
| Encapsulado | 6-SIP Module, Case 867E-03 | — |
| Sensing Technology | Piezoresistive (silicon strain gauge) | — |
| Tipo de montaje | Through-hole, axial tube | Through-Hole |
| Estado RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status of this lot] |
| Operating Pressure | — | 1.45 PSI (10 kPa) |
| Maximum Pressure | — | [DATA_NEEDED: maximum overpressure rating] |
| Tensión de salida | — | 0 mV to 25 mV at 10 V excitation |
| Tensión de alimentación | — | 10 V to 16 V |
| Port Size | — | Male - 0.19" (4.93 mm) Tube |
| Port Style | — | Barbed, single vented-gauge port |
| Encapsulado / Carcasa | — | 4-SIP Module |
| Technology | — | Piezoresistive (silicon diaphragm) |
| Compensation | — | On-chip temperature compensated and calibrated |